Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
October 1, 2024 | Indium CorporationEstimated reading time: 1 minute
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Indium Corporation will showcase the following among its featured products:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
Indium Corporation’s innovative solder and alloy technologies are designed to meet the stringent requirements of the electric vehicle market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry's drive towards sustainability and longer-lasting products. By offering advanced materials solutions like Durafuse® and Indalloy®, Indium Corporation helps automakers and battery manufacturers tackle the challenges of electrification and develop next-generation EV technologies.
To learn more about Indium Corporation’s solutions, visit our experts at the Detroit Battery Show in hall A-C, booth #733.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Indium Corporation to Highlight High-Reliability Solder Solutions for EV and Mobile at Productronica India
04/01/2026 | Indium CorporationAs a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation® will showcase its advanced Rel-ion® products at Productronica India, April 8-10, in Greater Noida, India.
Small Ohio Company's Chemistry Breakthrough Could Have Major Defense Implications
03/19/2026 | PRNewswireREalloys Inc. (ALOY), a North American rare earth metallization company, says it has successfully demonstrated a new process for producing rare earth fluorides without hydrofluoric acid—one of the most hazardous chemicals traditionally used in rare earth processing.
Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium
11/05/2025 | Real Time with...SMTAIIn this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
Advancements in High-reliability Alloys for Automotive and High-performance Applications
05/22/2025 | Barry Matties, I-Connect007At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA Innolot, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.