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Advanced Electronics Packaging Digest

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SMTA Connecticut Chapter Announces Open House at Microscreen's New Manufacturing Facility

10/23/2026 | SMTA
The SMTA Connecticut Chapter is inviting electronics manufacturing professionals to an Open House at Microscreen's new stencil manufacturing facility in Oxford, Connecticut, on Thursday, December 10, 2026, from 4:00 PM to 7:00 PM.

Indium Highlights Advanced Solder Solutions for Electronics Manufacturing at EFX 2026

09/29/2026 | Indium Corporation
As an industry leader in innovative materials solutions for electronics packaging, Indium Corporation® will showcase its high-reliability solder pastes for PCB assembly and automotive applications at Expo for Electronics Manufacturing (EFX) 2026, October 6-8, in Stuttgart, Germany.

Indium to Highlight High-Reliability Solder, Low-Silver, and Thermal Management Solutions at Productronica India

09/02/2026 | Indium Corporation
With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance solder pastes, lower-cost, low-silver solder alloys, and thermal interface materials solutions at Productronica India, September 16-18, in Bengaluru, India.

The 2027 Defense Deadline That is Forcing the U.S. to Rebuild 40 Years of Lost Tech

05/13/2026 | PRNewswire
Roughly 40 years ago, the United States made a decision that seemed perfectly rational at the time: it stopped processing rare earths.

Indium Corporation to Highlight High-Reliability Solder Solutions for EV and Mobile at Productronica India

04/01/2026 | Indium Corporation
As a leading materials provider to the electric vehicle (EV) and e-mobility industries—addressing power module- and PCBA-level applications—Indium Corporation® will showcase its advanced Rel-ion® products at Productronica India, April 8-10, in Greater Noida, India.
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