The New Chapter: The Benefits of Continuing Education
Marcy’s Musings: Boosting Your Inner Layer Precision and Production Outcomes
It’s Only Common Sense: You’ve Got to Hustle
Introducing the Ultra HDI Learning Pavilion at SMTA International 2024
October 7, 2024 | SMTAEstimated reading time: 2 minutes
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology. Taking place in booth #2753 during SMTA International, October 22-24, 2024 in Rosemont, Illinois, this interactive and educational pavilion is FREE and open to all attendees.
The UHDI Pavilion will serve as the hub for industry professionals eager to dive into the world of UHDI, where groundbreaking advancements in miniaturization are pushing the boundaries of electronics manufacturing. Attendees can explore a packed schedule of technical sessions led by experts from across the supply chain, focusing on UHDI Test Board design, fabrication materials, assembly processes, and solutions to address the ongoing challenges of miniaturization.
Key Highlights of the UHDI Pavilion:
Technical Sessions:
A diverse range of sessions will cover essential topics such as UHDI Test Board Design, Ultra HDI Demand, Fabrication, Materials, Ultra-Fine Solder Powders, Stencil, Inspection and Component Placement. Industry experts will share their insights and innovations.
"Lab to Fab" Working Session:
On Wednesday, October 23 from 3:00 to 4:00 PM, join Elliott Fowler of Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea for the "Lab to Fab" working session. This session is designed to break down silos and foster collaboration across the supply chain, accelerating the transition from concept to production.
Networking Opportunities:
The UHDI Pavilion will also feature dedicated networking time on Thursday, October 24, allowing attendees to connect with key players in the UHDI space and explore potential partnerships.
Ultra HDI Pavilion Schedule Highlights:
Wednesday, October 23
- 10:00-10:20: Chrys Shea, Shea Engineering, "UHDI Test Board Design and Reasoning"
- 10:30-11:15: Guest Speaker, "Demand and Why We Need UHDI"
- 11:30-11:50: Paul Cooke, AGC, "Fabrication Materials for UHDI"
- 12:00-12:20: John Johnson, ASC, "Fabrication Processes for UHDI"
- 12:30-12:50: Greg Smith, Blue Ring, "Stencil"
- 1:00-1:20: Gayle Towell, AIM Solder, "Materials (Ultra Fine Powders)"
- 1:30-1:50: Brent Fischthal, Koh Young America, "Inspection"
- 2:00-2:20: Guest Speaker, "Component Placement"
- 2:30-2:50: Bill Capen, Honeywell FM&T, "Cleaning and SIR"
- 3:00-4:00: Elliott Fowler, Sandia National Laboratories, Bill Capen, Honeywell FM&T and Chrys Shea, Shea Engineering, "Lab to Fab - Working Session"
Thursday, October 24
- 10:00-10:30: Paul Cooke, AGC, "Additive Fabrication Options: What’s the Big Deal?"
- 11:00-11:30: John Johnson, ASC, "It Depends: PCB Design Trade-Offs"
- 11:30-1:00: Networking Session
Share on:
Suggested Items
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
Real Time with... electronica 2024: NCAB—Shaping the Future of Electronics Manufacturing
12/05/2024 | Real Time with... electronicaMichael Larsson, Global Director of Sales at NCAB, shares insights into the company's focus on sourcing production outside of China as well as their commitment to sustainability through innovative materials for recyclable PCBs.
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 1
11/14/2024 | Anaya Vardya, American Standard CircuitsLast month, I talked about ultra high definition interconnect (UHDI) in relation to entertainment applications. This month, I will explain bleeding-edge UHDI applications in manufacturing, which are revolutionizing the industry by enabling ultra-precise visual data transmission, high-speed communication between devices, and real-time monitoring. These UHDI technologies help manufacturers achieve higher efficiency, better quality control, and greater automation. Following are some leading-edge manufacturing applications of UHDI in manufacturing.
UHDI Fundamentals: ‘UHDI’ Bleeding-edge Entertainment Applications, Part 1
10/10/2024 | Anaya Vardya, American Standard CircuitsAs soon as we cross below the 1-mil (0.001") line width threshold, we need to stop talking in terms of mils and ounces and begin talking in terms of microns. For reference, a 3-mil trace is 75 microns, so a 1-mil trace is 25 microns. In general terms, ultra high density interconnect refers to line and spaces on a printed circuit board that are sub-25 micron. In the context of this article, ultra high-definition interconnect (UHDI) refers to the technology and infrastructure used to transmit and connect ultra high-definition signals, typically 4K, 8K, or even higher resolutions, across devices like displays, cameras, servers, and processors.