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ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
October 8, 2024 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
The SMTA International Conference & Expo provides an excellent opportunity for ViTrox to connect with suppliers, buyers, and users within the electronics manufacturing and assembly industry. This year, ViTrox proudly presents V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution and award-winning V9i Advanced Robotic Vision (ARV) Solution, setting a new standard in flexible inspections for conformal coating and final assembly.
Discover ViTrox's State-of-the-Art Inspection Solutions:
V310i Advanced 3D Solder Paste Inspection (SPI) Solution
This solution is engineered to deliver unmatched precision in solder paste inspection and is suitable for operators of all levels. Its Ultra Smart Programming feature allows users to easily set parameters, reducing human dependency and enabling faster programming for increased productivity. It complies with IPC-CFX-2591 standards, ensuring optimal results and setting a new industry standard for solder paste inspection.
V510i Advanced 3D Optical Inspection (AOI) Solution
ViTrox’s V510i 3D AOI Solution integrates advanced Artificial Intelligence (A.I.) Smart Technologies, automates programming and buy-off processes. This reduces reliance on skilled manual labour and minimises human error. With A.I. Smart Programming, users can achieve up to a 4x reduction in programming time, enhancing yield. The A.I. Assisted Defect Review (A.I. VVTS) feature further automates defect verification in repair stations, delivering over 90% judgement accuracy. This leads to approximately a 60% reduction in labour costs. Additionally, the solution meets IPC-CFX-2591 standards, earning its place on the Qualified Products Listing (QPL) and ensuring seamless integration with Industry 4.0 smart manufacturing environments. The V510i 3D has been widely recognised for its outstanding performance, receiving multiple esteemed awards such as the 2024 New Product Introduction Award, 2023 Global Technology Award and 2023 Mexico Technology Award.
V9i Advanced Robotic Vision (ARV) Solution
The V9i ARV features a 6-axis COBOT design, allowing adjustable angle inspections up to 90°. Its Advanced Smart Learning Algorithm detects various conformal coating defects and performs final assembly inspections of screws, cosmetics, connectors and labels without requiring CAD data. With multifocal vision ranging from 5mm to 200mm and image clarity up to 14µm/px, it ensures accurate defect detection. Seamlessly integrating into production lines via SMEMA or operating offline, the V9i ARV enhances traceability and provides reliable, comprehensive inspection coverage. The V9i ARV has earned prestigious industry awards, including the 2024 New Product Introduction Award, 2021 Global Technology Award and 2020 IPC APEX EXPO Innovation Award, recognising its outstanding performance and innovation.
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Sweeney Ng - CEE PCBSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: