Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

Foxconn Adds Two WEF New Lighthouse Factories

10/11/2024 | Foxconn
The World Economic Forum (WEF) has recognized two more Hon Hai Technology Group facilities as Lighthouse factories. Subsidiary Foxconn Industrial Internet's Bac Giang Province facility becomes Vietnam's first Lighthouse factory, while the Guanlan factory in Shenzhen, China, is certified as Foxconn's first Sustainable Lighthouse.

Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

10/08/2024 | TSMC
Amkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.

Amentum Secures $256M Contract to Propel NASA’s Space Exploration Projects

10/07/2024 | BUSINESS WIRE
Amentum was awarded the Fully Integrated Lifecycle Mission Support Services II (FILMSS II) contract by NASA with a maximum value of $256 million to spearhead cutting-edge technologies and manage groundbreaking science projects in support of NASA’s exploration and aeronautics objectives at the Ames Research Center.

TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation

10/04/2024 | TAIFLEX Scientific Co. Ltd
Tazmo Co., Ltd. and TAIFLEX Co., Ltd.  held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in