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ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
October 8, 2024 | ViTroxEstimated reading time: 2 minutes
ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.
The SMTA International Conference & Expo provides an excellent opportunity for ViTrox to connect with suppliers, buyers, and users within the electronics manufacturing and assembly industry. This year, ViTrox proudly presents V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution and award-winning V9i Advanced Robotic Vision (ARV) Solution, setting a new standard in flexible inspections for conformal coating and final assembly.
Discover ViTrox's State-of-the-Art Inspection Solutions:
V310i Advanced 3D Solder Paste Inspection (SPI) Solution
This solution is engineered to deliver unmatched precision in solder paste inspection and is suitable for operators of all levels. Its Ultra Smart Programming feature allows users to easily set parameters, reducing human dependency and enabling faster programming for increased productivity. It complies with IPC-CFX-2591 standards, ensuring optimal results and setting a new industry standard for solder paste inspection.
V510i Advanced 3D Optical Inspection (AOI) Solution
ViTrox’s V510i 3D AOI Solution integrates advanced Artificial Intelligence (A.I.) Smart Technologies, automates programming and buy-off processes. This reduces reliance on skilled manual labour and minimises human error. With A.I. Smart Programming, users can achieve up to a 4x reduction in programming time, enhancing yield. The A.I. Assisted Defect Review (A.I. VVTS) feature further automates defect verification in repair stations, delivering over 90% judgement accuracy. This leads to approximately a 60% reduction in labour costs. Additionally, the solution meets IPC-CFX-2591 standards, earning its place on the Qualified Products Listing (QPL) and ensuring seamless integration with Industry 4.0 smart manufacturing environments. The V510i 3D has been widely recognised for its outstanding performance, receiving multiple esteemed awards such as the 2024 New Product Introduction Award, 2023 Global Technology Award and 2023 Mexico Technology Award.
V9i Advanced Robotic Vision (ARV) Solution
The V9i ARV features a 6-axis COBOT design, allowing adjustable angle inspections up to 90°. Its Advanced Smart Learning Algorithm detects various conformal coating defects and performs final assembly inspections of screws, cosmetics, connectors and labels without requiring CAD data. With multifocal vision ranging from 5mm to 200mm and image clarity up to 14µm/px, it ensures accurate defect detection. Seamlessly integrating into production lines via SMEMA or operating offline, the V9i ARV enhances traceability and provides reliable, comprehensive inspection coverage. The V9i ARV has earned prestigious industry awards, including the 2024 New Product Introduction Award, 2021 Global Technology Award and 2020 IPC APEX EXPO Innovation Award, recognising its outstanding performance and innovation.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial TeamTSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications
10/24/2025 | BUSINESS WIREYield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, announced that it has received multiple tool orders from a global leader in AI infrastructure solutions.
TSMC Reports Third Quarter EPS of NT$17.44
10/22/2025 | TSMCTSMC announced consolidated revenue of NT$989.92 billion, net income of NT$452.30 billion, and diluted earnings per share of NT$17.44 (US$2.92 per ADR unit) for the third quarter ended September 30, 2025.