SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
Nolan’s Notes: Tariffs, Technologies, and Optimization
Zhen Ding Technology Reports Record Revenue and Profitability in Q3 2024
October 9, 2024 | Zhen Ding TechnologyEstimated reading time: 1 minute
Zhen Ding Technology Holding Ltd. (ZDT), a global leader in high-quality printed circuit board (PCB) solutions, announced its financial results for the third quarter of 2024, marking the company's most successful quarter to date.
ZDT achieved consolidated revenue of NTD 58.2 billion in Q3 2024, reflecting an impressive 28.3% year-over-year growth. This record-breaking performance was driven by strong demand across all of the company’s business segments, particularly in high-density interconnect (HDI) and rigid-flex PCBs.
The company also reported a gross profit margin of 23.7%, underscoring its commitment to operational efficiency and cost management. Net profit surged to NTD 7.8 billion, a 58.8% increase from Q3 2023, further demonstrating ZDT's ability to scale profitability alongside revenue growth.
ZDT continues to strengthen its market position through investments in cutting-edge technologies. The company's expertise in fine-line processing, high-layer count PCB technology, and material science enables it to meet the increasing demand for more complex and miniaturized electronics. Key sectors like 5G, artificial intelligence (AI), and automotive electronics remain major growth drivers, positioning ZDT at the forefront of the evolving technology landscape.
With a positive outlook for Q4 2024, ZDT is confident in its ability to sustain growth momentum. As technological advancements in 5G, AI, and automotive continue to accelerate, ZDT expects to capitalize on emerging opportunities in the global PCB market. The company remains focused on innovation and operational excellence as key drivers of future success.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
Datest Marches Into SMTA International with Backup Plans, Big Partnerships, and Bigger X-rays
10/06/2025 | DatestDatest, the industry’s favorite second set of eyes (and hands, and solder joints), is heading to SMTA International 2025 at the Donald E. Stephens Convention Center in Rosemont, IL. Find us at Booth #2627, where high-reliability, high-complexity builds meet their match.
Imec’s New GeSi Modulator Hits 400Gb/s, Paving the Way for Next-Gen Optical Interconnects
10/02/2025 | ImecImec – a world-leading research and innovation hub in nanoelectronics and digital technologies – today announced the successful demonstration of a beyond-110GHz C-band GeSi electro-absorption modulator, fabricated on its 300mm silicon photonics platform.