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Suggested Items

Root-cause Analysis and Problem-solving

11/01/2024 | Happy Holden, I-Connect007
An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.

Discover the Future of PCB and PCBA at the International Electronics Circuit Exhibition

11/01/2024 | HKPCA
The International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show) is one of the largest and most influential trade shows in the PCB and electronic assembly industry. Having already been successfully held 21 times, the Show takes place every December.

CEE PCB to Exhibit at Electronica 2024

10/31/2024 | CEE PCB
Tom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.

Unlocking Advanced Circuitry Through Liquid Metal Ink

10/31/2024 | I-Connect007 Editorial Team
PCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.

Partial HDI: A Delicate Balance

10/30/2024 | I-Connect007 Editorial Team
Partial HDI can be the perfect solution for designers faced with escape routing from tight-pitch BGAs. But there are a variety of material, signal integrity, and DFM trade-offs to understand before you get fully into partial HDI. We asked Stephen Chavez to explain the fundamentals, as well as the details, of this promising process. Are you using partial HDI?
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