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Discover TRI's Solutions at Manufacturing Indonesia 2024
October 14, 2024 | TRIEstimated reading time: Less than a minute
PT Hibex Indonesia, the distributor of Test Research, Inc. (TRI), will take part in Indonesia's Leading Manufacturing, Machinery, Equipment, Materials, and Services Event, Manufacturing Indonesia 2024. The exhibition will be held at the International Expo Kemayoran in Jakarta, Indonesia, on December 4 –7, 2024. Visit PT Hibex Indonesia's booth for more insight into TRI's Test and Inspection Solutions for the Electronics Manufacturing Industry.
TRI offers Smart Testing and Inspection Solutions, which include 3D Solder Paste Inspection (SPI), 3D Automated Optical Inspection (AOI), Semiconductor Optical Inspection (SEMI AOI), 3D CT Automated X-ray Inspection (AXI), High-Performance In-Circuit Testing (ICT), and Manufacturing Defects Analyzers (MDA).
TRI's systems are designed to interoperate with other manufacturing equipment, minimize downtime, optimize production quality, and reduce operator workload. Our solutions comply with Industry 4.0 standards, such as IPC-Hermes-9852, IPC-DPMX, and Connected Factory Exchange (IPC-CFX).
TRI invites you to stop by PT Hibex Indonesia's booth to discuss test and inspection solutions for the electronics manufacturing Industry.
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Rachael Temple - AlltematedSuggested Items
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.