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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Compal Reports Solid September 2024 Sales, Maintains Growth Trajectory
October 14, 2024 | Compal Electronics Inc.Estimated reading time: Less than a minute
Compal Electronics Inc. announced consolidated revenue of NT$83.766 million for September 2024. This figure represents a slight decrease of 0.4% compared to August 2024. However, year-to-date revenue for 2024 remains strong at NT$681.098 million, reflecting a 3.4% decrease compared to the same period in 2023.
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Cicor Publishes Nine-month Results Report due to OEP Mandatory Offer
12/20/2024 | CicorCicor Group is publishing a nine-month report today. OEP has published a mandatory offer after it converted its Mandatory Convertible Bonds (MCNs) and thereby crossed the mandatory offer threshold.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/20/2024 | Nolan Johnson, I-Connect007Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Siemens Extends Veloce Hardware-assisted Verification Support of EPGM Ethernet to 1.6 Tbps
12/18/2024 | SiemensSiemens Digital Industries Software announced today an extension of its Veloce™ hardware-assisted verification platform to support 1.6 Tbps Ethernet. As a core component of the Siemens software/hardware and system validation platform, Veloce delivers complete virtual models to support Ethernet Packet Generator and Monitor (EPGM) Ethernet port speeds up to 1.6 Tbps.