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Dan’s Biz Bookshelf: ‘From Bud to Boss: Secrets to a Successful Transition to Remarkable Leadership’Ventec Promotes Bill Wang to Group Technical Vice President
October 14, 2024 | VentecEstimated reading time: 1 minute
Ventec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President.
Having served as Ventec’s Technical Director since 2013, Bill now adds responsibility for the group’s overseas business units to his remit, leveraging the company’s wide-ranging expertise to create solutions in sectors such as high-performance computing, cloud servers, communications and networking, cellular infrastructure, consumer products, and solid-state lighting. He will continue to lead the Technical Department at the company’s global headquarters, while also directing the Global OEM Technology and IMS Technology sections in the EMEA and Americas regions.
Welcoming him in his new role, Jason Chung, Ventec International Group CEO, said, “Bill’s energy has driven our technical department to ever-greater achievements and our current pre-eminent position in substrate materials that deliver cutting-edge performance. He richly deserves the extra faith we are placing in him, and I have every confidence he will continue to expand our capabilities and strengthen our leading position.”
Bill commented, “Ventec’s technical prowess, alongside our supply-chain capabilities and global customer support services, are key differentiators for our business. I am excited to be working with our global teams to build our strength and continue extending our advantage.”
Ventec’s product portfolio encompasses signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. The comprehensive product line includes pro-bond and thermal-bond resin-coated films for signal-integrity applications, flex/flex-rigid and thin-flex products, and materials for special applications. The group also provides value added technical services, lab capabilities, and capital equipment for PCB fabrication.
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