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Advanced Electronics Packaging Digest

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Micron Unveils Ultra-Dense Memory Module for Next-Gen Servers

09/18/2026 | Micron
Micron Technology, Inc., announced a major milestone in memory innovation with the successful demonstration of the world's first 512GB DDR5 module on multiple server platforms.

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TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications.

Worldwide Server Market Revenue Hits Record $166.3 Billion in Q2 2026

09/15/2026 | IDC
The worldwide server market reached a record $166.3 billion in vendor revenue in the second quarter of 2026 — the highest quarterly total in the history of IDC’s Worldwide Quarterly Server Tracker, surpassing the previous high of $125.3 billion set in the fourth quarter of 2025.

Memory Prices Soar; DRAM and NAND Flash to Account for 68% of Major CSP CapEx in 2027

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According to TrendForce’s latest memory industry research, major global cloud service providers (CSPs) are accelerating AI infrastructure investment, with total CapEx projected to surge 98% YoY in 2026 and rise another 50% in 2027.

Compal Opens Daxi AI Server Manufacturing Center

08/12/2026 | PRNewswire
Compal Electronics held the opening ceremony for its Daxi AI Server Manufacturing Center, officially launching next-generation AI server manufacturing capacity.
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