Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Fall 2024 Issue of IPC Community Now Available
October 14, 2024 | IPC Community Editorial TeamEstimated reading time: 1 minute
There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way.
Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
We feature an in-depth conversation with European market researcher Dieter Weiss, who’s giving back to the industry through data research, and you must read about the somewhat unconventional but ultimately satisfying sustainability-driven lifestyle of IPC course instructor Kris Moyer.
IPC Chief Economist Shawn DuBravac breaks down inventory costs following the pandemic, while IPC Japan Representative Yusaku Kono gives an update on how Japan’s electronics economy is recovering after the pandemic and the phenomenal growth of IPC standards and certifications in Japan.
Regarding sustainability, IPC Community visited with Zhou (Peter) Guoyin, a pioneer in ESG standards. You can also learn more about circularity in electronics from IPC's Lead Sustainability Strategist, Kelly Scanlon, and Stanley Merritt, a member of the IPC Sustainability Leadership Council, who educates us on supply chain sustainability, particularly in aerospace and defense.
We’ve devoted a special section to IEMI, the premier electronics manufacturing trade show sponsored by IPC India, which crossed borders this year to host events in Malaysia and India with great success. Dr. John W. Mitchell, president and CEO of IPC, attended both events and shares his insights on what it means to host the event in Malaysia.
For printed circuit board designers, we've highlighted the Pan-European Design Conference in January, where you can learn how to participate in this exciting new opportunity in Vienna.
As always, you’ll discover instructor-led courses happening this winter, learn about the latest standards releases, and see what's happening around the world with IPC in our Q4 calendar.
So, settle in with your favorite pumpkin-spiced treat and enjoy our latest issue!
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Julia McCaffrey - NCAB GroupSuggested Items
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.