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High Density Packaging User Group Announces Dynamic Electronics Membership
October 14, 2024 | High Density Packaging User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
“Dynamic’s mission is to provide leading-edge printed circuit board solutions for our customers. We achieve this with a combination of state-of-the-art equipment and processes; using advanced materials including laminate and prepreg, copper foil, chemistries and soldermask; and best-in-class automation and traceability,” said Mike McMaster, North America Engineering Director at Dynamic. “Dynamic is very excited to join HDP, especially as we open our new, advanced manufacturing facility in Thailand. HDP gives Dynamic the ability to collaborate with leaders across the PCB industry and deliver products that exceed our customer’s expectations.”
“I am pleased to welcome Dynamic to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in leading edge PCBs for high-speed computing and data systems, including high layer count HDI buildup, and high-reliability automotive PCBs, will contribute significantly to our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
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