Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
High Density Packaging User Group Announces Dynamic Electronics Membership
October 14, 2024 | High Density Packaging User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
“Dynamic’s mission is to provide leading-edge printed circuit board solutions for our customers. We achieve this with a combination of state-of-the-art equipment and processes; using advanced materials including laminate and prepreg, copper foil, chemistries and soldermask; and best-in-class automation and traceability,” said Mike McMaster, North America Engineering Director at Dynamic. “Dynamic is very excited to join HDP, especially as we open our new, advanced manufacturing facility in Thailand. HDP gives Dynamic the ability to collaborate with leaders across the PCB industry and deliver products that exceed our customer’s expectations.”
“I am pleased to welcome Dynamic to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in leading edge PCBs for high-speed computing and data systems, including high layer count HDI buildup, and high-reliability automotive PCBs, will contribute significantly to our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Taking Control of PCB Verification One Step at a Time
10/09/2025 | Kirk Fabbri, Siemens EDAToday’s designs are as complex as ever, and engineers face tough decisions every day. Simulation and verification teams are confronted with a three-fold challenge: understanding the underlying theory, mastering the tools, and applying best practices.Engineers need to navigate a vast and ever-changing cast of design and simulation tools, often with overlapping functionality.
STI Electronics and Impulse Dynamics Celebrate Their Alliance for a Cutting-Edge Heart Failure Device
09/24/2025 | STI Electronics, Inc.STI Electronics, Inc., a full-service organization providing Contract Electronics Manufacturing, Training Services, Training Materials, Analytical/Material Failure Analysis and Prototyping, is proud to announce its relationship with Impulse Dynamics® in the development of its next-generation heart failure platform that is currently under clinical evaluation.
New Frontier Aerospace and Air Force Institute of Technology Sign CRADA to Advance Hypersonic VTOL Aircraft
08/05/2025 | PR NewswireNew Frontier Aerospace (NFA) is excited to announce a Collaborative Research and Development Agreement (CRADA) with the Air Force Institute of Technology (AFIT) aimed at advancing an innovative rocket-powered hypersonic Vertical Takeoff and Landing (VTOL) aircraft.
Altair, JetZero Join Forces to Propel Aerospace Innovation
03/26/2025 | AltairAltair, a global leader in computational intelligence, and JetZero, a company dedicated to developing the world’s first commercial blended wing airplane, have joined forces to drive next-generation aerospace innovation.
Maritime Launch and Reaction Dynamics Driving a Canadian Orbital Launch Solution in the Global Space Economy
10/15/2024 | BUSINESS WIREMaritime Launch Services Ltd. (Maritime Launch) and Reaction Dynamics (RDX) are announcing the next steps in their continuing collaboration with the signing of an agreement for future orbital launches from Canada.