It’s Only Common Sense: Customer Service Is Sales in Disguise
Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Vitronics Soltec Unveils Advanced Heavy Board Options for Reflow Soldering System
October 15, 2024 | Vitronics SoltecEstimated reading time: Less than a minute
Vitronics Soltec, a leader in reflow soldering technology, announces the launch of new Heavy Board options for its industry-leading Centurion 1240 reflow soldering system. This innovative enhancement is designed to provide unmatched thermal performance and maximum throughput, addressing the evolving challenges of dense and heavy assemblies in the electronics manufacturing industry.
The CT 1240 stands out for its ability to meet the most stringent industry requirements without increasing the machine’s footprint. While many suppliers respond to the increasing density of assemblies by extending oven length, Vitronics Soltec has taken a different approach. The new Heavy Board options enhance the CT 1240’s capabilities, allowing for improved handling of heavier boards while boosting throughput.
Vitronics Soltec remains committed to delivering innovative solutions that enhance productivity and efficiency in the electronics manufacturing sector. The Heavy Board options for the CT 1240 are a testament to this dedication, ensuring that customers can meet the growing demands of the industry without compromising on space or performance.
Share on:
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.