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Build Better 2024 Summit: Creating a Vision for Future Tech
October 18, 2024 | Marcy LaRont, I-Connect007Estimated reading time: 4 minutes
The morning portion kicked off with “The Apple Way, the Motorola Way and the Next Way,” which was described as, “There are lots of ‘ways’ to do electronics NPI and manufacturing. Motorola gave us EVT, DVT, and PVT and Apple gave us execution at scale. What are the core lessons of these methodologies and how are modern organizations honoring or breaking them?” An interesting panel discussion ensued with Zach Scott, head of hardware at Backbone, Matt Hill, senior of device engineering at Snap Inc., and Felix Alvarez, manager of Second Order Effects. Their words were simple but wise: Learn from history but don’t be limited by it; the key to success is continuous, deep learning throughout your career; and (my personal favorite) don’t play by the rules that others have set out for you. Don’t be afraid to take a chance.
In another presentation, Sapana Talwaker, VP of hardware operations at Toast, spoke about scaling manufacturing, and was asked how she defines operational excellence. She responded that operational excellence occurs when operations are closely aligned with the organization’s objectives, when continuous improvement is built into the system, and when it can react and adapt as needed. She cited adaptability as perhaps the single most important characteristic for operational excellence in “the next way.” Toast is a POS platform, which is largely a software product. Talwaker underscored the importance of hardware in a software-focused world, “Hardware is an enabler product for Toast,” she said. Being out of stock is not an option, as it means missing out on much greater revenue opportunities. The two are inextricably linked. One simply does not work without the other—hinting at our industry’s own, “silicon to systems” approach to discussing chips and packaging.
Valentina Ratner, co-founder of AllSpice.io, a collaborative platform for engineers developing new products, gave a presentation on a survey titled “The State of Hardware 2025: 1,000 Engineers on Trends, Challenges, and Toolsets,” which provided data about the things we were pretty sure we already knew.
The greatest challenge for engineers over the past year has been shrinking product development cycles and deadlines. They have spent too many hours a week troubleshooting problems, although it’s probably the most helpful skill making someone a more efficient and effective engineer. In both the latter scenarios, it was pointed out how specific software tools can add tremendous value. Interestingly, they cited the feeling that only 25% of software, hardware, PCB, and firmware companies collaborate effectively. I also found it interesting, especially in view of ever-shrinking product development cycle times, was that 48% of the 1,000 engineers surveyed said they did between three to five iterations per product prior to release. From the conference, it was clear that hardware manufacturing is changing and the integration of high-level software tools that incorporate sophisticated AI functionality will be a very significant part of “the next way” for manufacturing. This is not groundbreaking knowledge for sure, but it is always interesting to see how the varied electronics industry is taking the same language and headed in the same overall direction.
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
The Next Generation of Leadership: New Student Board Member Aubrey Smith
04/10/2026 | Marcy LaRont, I-Connect007At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.
ASC Sunstone Circuits Implements Smart Parts Technology at Mulino Facility to Enhance PCB Manufacturing Efficiency
04/09/2026 | ASC Sunstone CircuitsASC Sunstone Circuits, a division of American Standard Circuits, has implemented Smart PartsTM Classics technology at its Mulino, Oregon, manufacturing facility, advancing its commitment to efficient, high-quality PCB fabrication.
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
04/09/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfI just finished "The NVIDIA Way" by Tae Kim, and let me tell you, this isn’t just a book about a semiconductor company. It’s a book about conviction, stubborn vision, and, most of all, what happens when a leader refuses to think small. At the center of it all is Jensen Huang. Kim does a masterful job showing us that NVIDIA’s rise wasn’t luck, timing, or some Silicon Valley fairy dust. It was discipline and obsession. It was long-term thinking in a world addicted to quarterly results.
Meet Emerging Engineer Logan Bistodeau, IBM
04/09/2026 | Michelle Te, I-Connect007When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.