Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Smart Textile Integration with Flex PCBs

08/10/2026 | Anaya Vardya, American Standard Circuits
The idea of clothing that monitors your health sounds like science fiction. It is not. Flex PCBs, integrated with conductive yarns and polymer substrates, are turning ordinary fabric into diagnostic platforms and turning your shirt into a medical device. The implications for healthcare, athletics, and workplace safety are profound. The fundamental engineering challenge of wearable electronics has always been the interface between two incompatible worlds: the rigid, planar world of conventional electronics and the soft, stretchy, washable world of textiles. Early smart garments solved this by simply attaching a rigid sensor pod to clothing, which was functional but bulky and uncomfortable. Flex PCBs collapse that boundary.

It’s Only Common Sense: Stop Watching the Headlines and Start Watching the Opportunity

07/27/2026 | Dan Beaulieu -- Column: It's Only Common Sense
If you spend too much time watching the news, you could easily convince yourself that the electronics industry is headed for trouble. Every day seems to bring another story about tariffs, supply chain disruptions, labor shortages, geopolitical tensions, inflation, slowing economies, or uncertainty in global markets. It is enough to make even experienced business leaders question what comes next.

Fresh PCB Concepts: Engineering Copper Coin and Copper Pedestal Technology With IPC Design Interpretation

06/25/2026 | Team NCAB -- Column: Fresh PCB Concepts
Copper coin and copper pedestal technologies have become increasingly important in modern PCB design as thermal demands rise in power electronics, automotive systems, RF applications, aerospace electronics, and high-density computing environments. As component power density increases and board sizes shrink, traditional thermal management techniques often become insufficient to maintain acceptable operating temperatures and long-term reliability.

PARMI Supports Customer Demonstration Request at Technica USA Demo Center

06/08/2026 | Technica USA
PARMI USA recently responded to a customer-requested demonstration of the PARMI Exceed, the company’s state-of-the-art AI-powered Automated Optical Inspection (AOI) system, at the Technica USA Demo Center.

Fresh PCB Concepts: Dynamic Solder Mask Compensation in PCBs

03/19/2026 | Team NCAB -- Column: Fresh PCB Concepts
Solder mask has traditionally been treated as a secondary design layer, generated automatically after routing, reviewed briefly, and rarely revisited. In contemporary PCB fabrication, that assumption no longer holds. As conductor geometries shrink and assembly temperatures rise, solder mask has become a significant factor that influences manufacturability, yield, and long-term reliability.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in