-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
October 22, 2024 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), October 27-30, 2024, in Fort Lauderdale, Florida. IEEE BCICTS will bring together leaders from across the semiconductor industry to discuss and demonstrate the latest advances in integrated circuit technology for applications across automotive, wireless, and aerospace sectors.
At IEEE BCICTS, StratEdge will highlight its robust lineup of thermally-enhanced ceramic and molded semiconductor packages. Engineered to support critical applications from DC to 63+ GHz, these packages provide ultra-low-loss performance, dissipate heat efficiently, and deliver high-frequency reliability essential for today’s high-demand devices. With a broad selection of open-tooled designs available, StratEdge's packaging solutions support seamless integration and optimize performance across various mounting configurations. Of particular interest shown in the accompanying photograph is LL6845-10-3, a Leaded Laminate (LL) series package that was designed specifically for GaAs and GaNa devices operating from 26.5-31 GHz.
"IEEE BCICTS is an invaluable forum for connecting with industry innovators who understand the importance of packaging that meets the exacting demands of high-frequency, high-power applications," emphasized Casey Krawiec, VP of Global Sales at StratEdge. "Our expertise in thermal management and high-frequency transmission line design, combined with our state-of-the-art Assembly Services, enables us to offer complete packaging solutions that enhance device performance and reliability. By leveraging our advanced wire bonding and die attach systems in a certified cleanroom environment, customers gain significant advantages in quality and efficiency."
IEEE BCICTS 2024 attendees are invited to visit StratEdge's exhibit, connect with their team of packaging experts, and learn how StratEdge can meet specific high-frequency packaging needs.
Suggested Items
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
Calumet Electronics Leads US Organic Substrate Technology Innovation with KLA Corporation
10/17/2024 | Calumet ElectronicsCalumet Electronics of Michigan today announced it is pioneering organic substrate technology in the United States in collaboration with KLA Corporation, which also has a Michigan headquarters. KLA Corporation is a global technology leader that develops equipment and services to enable innovation throughout the electronics industry. The company provides advanced process control and process-enabling solutions used in the manufacturing of semiconductors and electronics.
SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
10/15/2024 | SEMISemiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
10/08/2024 | TSMCAmkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation
10/04/2024 | TAIFLEX Scientific Co. LtdTazmo Co., Ltd. and TAIFLEX Co., Ltd. held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei.