Nolan’s Notes: Our Spotlight on Europe
One World, One Industry: Attending APEX EXPO 2026 Critical for Electronics Manufacturing Leaders
Standard of Excellence: Building the Board of the Future—Materials, Methods, and Mindset
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Space Coast Expo & Tech Forum
October 22, 2024 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Space Coast Expo & Tech Forum taking place on November 14 at the Melbourne Auditorium in Melbourne, Florida. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Space Coast Expo & Tech Forum on November 14.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AIM Solder Hires Francisco Rodriguez as Regional Sales Manager for Northeast Mexico
03/09/2026 | AIM SolderAIM Solder is pleased to hire Francisco Rodriguez as Regional Sales Manager for Northeast Mexico.
SMTA International 2025 Conference Awards Announced
03/09/2026 | SMTAThe SMTA is pleased to announce the technical conference awards from SMTA International 2025. The winners were selected by members of the conference technical committee.
SolderKing Expands Solder Paste Range with SAC0307 Low-Silver Alloy Option
03/05/2026 | SolderKingSolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range.
KOKI Showcases BIG Low-Ag and ICT-ready Solutions at APEX EXPO 2026
03/05/2026 | KOKIKOKI Solder America, a global leader in advanced soldering materialsannounces that it will be exhibiting at APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California.
Microscreen Expands New England Coverage for High-Precision SMT Stencils
03/04/2026 | MicroscreenMicroscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, has appointed Yankee Soldering Technology as its representative firm for the New England region.