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Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
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AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Space Coast Expo & Tech Forum
October 22, 2024 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Space Coast Expo & Tech Forum taking place on November 14 at the Melbourne Auditorium in Melbourne, Florida. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Space Coast Expo & Tech Forum on November 14.
Suggested Items
HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor
12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
Nolan’s Notes: Soldering Technologies
12/03/2024 | Nolan Johnson -- Column: Nolan's NotesThere are schools of thought that soldering methods are similarly anachronistic but still useful enough not to be worth changing. While that may be true, I see that soldering technologies are experiencing significant changes. It might not be apparent on the surface, but changes are afoot, and there are some disruptive things underway as well.
SMT007 Magazine Explores Soldering Technologies—December 2024
12/02/2024 | I-Connect007 Editorial TeamSoldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/29/2024 | Nolan Johnson, I-Connect007If you’re in the U.S. today, odds are you’re at home enjoying the aftermath of a Thanksgiving holiday meal. Let me just say that whether you had a Thanksgiving holiday surrounded by family, friends, or both, I hope it was joyous. If you know someone who doesn’t have friends or family with whom to share this time, please reach out and include them. Chronic loneliness can exact a measurable toll on our mental and physical health. Wherever you are on the globe this holiday season, I encourage you to reach out to someone who might be battling loneliness and connect. It will make a difference to them. Not only will it help get you in the mood for your winter holiday of choice, but it’ll be good for your mental health as well.
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.