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Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.

Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating

04/15/2025 | Michael Carano -- Column: Trouble in Your Tank
There are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.

Real Time with... IPC APEX EXPO 2025: MKS' Atotech—Leading Innovations in Semiconductor Solutions

03/28/2025 | Real Time with...IPC APEX EXPO
In this interview, Marcy LaRont speaks with Kuldip Johal, CTO, MKS’ Atotech. Based in Boston, MKS operates in vacuum solutions, photonics, and specifically for the Atotech division, material solutions.  MKS significantly impacts the semiconductor industry, supplying components for up to 85% of global semiconductor tools and covers processes and materials for 70% of PCB manufacturing steps.

Gold as a Key Component in PCBs and IC Substrates

03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' Atotech
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.

PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025

03/17/2025 | I-Connect007 Editorial Team
In the March 2025 issue of PCB007 Magazine, we go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. 
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