New Information Now Available for Popular Podcast Series on PCB Design
October 24, 2024 | I-Connect007Estimated reading time: 1 minute

Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.
The world of PCB design is undergoing a remarkable transformation. While advancements in AI, 3D printing, and innovative materials are reshaping the landscape, the industry also faces the challenge of a retiring generation of veteran designers. In this era of change, the need for smarter, faster, and more cost-effective design methodologies has never been greater.
Discover how Cadence is addressing these evolving demands by visiting our podcast page. There, you'll find insightful content, including episodes like “Why Do We Need to Change,” “How Will AI Play a Role,” and “More Power to the EE,” offering valuable perspectives on the future of PCB design.
At I-Connect007, we're committed to delivering valuable content that supports the global electronics community. From magazines, books, and newsletters to podcasts, market reports, and event coverage, we offer diverse resources to help you thrive in the industry.
As the longest-running digital media company in the electronics supply chain, I-Connect007 continues to provide exclusive, high-quality content.
We hope you enjoy the PCB 3.0: A New Design Methodology podcast series and its companion guide.
Suggested Items
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
Showing Some Constraint: Design007 Magazine July 2025
07/10/2025 | I-Connect007 Editorial TeamA robust design constraint strategy balances dozens of electrical and manufacturing trade-offs. This month, we focus on design constraints—the requirements, challenges, and best practices for setting up the right constraint strategy.
Elementary, Mr. Watson: Rein in Your Design Constraints
07/10/2025 | John Watson -- Column: Elementary, Mr. WatsonI remember the long hours spent at the light table, carefully laying down black tape to shape each trace, cutting and aligning pads with surgical precision on sheets of Mylar. I often went home with nicks on my fingers from the X-Acto knives and bits of tape all over me. It was as much an art form as it was an engineering task—tactile and methodical, requiring the patience of a sculptor. A lot has changed in PCB design over the years.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.