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New Information Now Available for Popular Podcast Series on PCB Design
October 24, 2024 | I-Connect007Estimated reading time: 1 minute
Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.
The world of PCB design is undergoing a remarkable transformation. While advancements in AI, 3D printing, and innovative materials are reshaping the landscape, the industry also faces the challenge of a retiring generation of veteran designers. In this era of change, the need for smarter, faster, and more cost-effective design methodologies has never been greater.
Discover how Cadence is addressing these evolving demands by visiting our podcast page. There, you'll find insightful content, including episodes like “Why Do We Need to Change,” “How Will AI Play a Role,” and “More Power to the EE,” offering valuable perspectives on the future of PCB design.
At I-Connect007, we're committed to delivering valuable content that supports the global electronics community. From magazines, books, and newsletters to podcasts, market reports, and event coverage, we offer diverse resources to help you thrive in the industry.
As the longest-running digital media company in the electronics supply chain, I-Connect007 continues to provide exclusive, high-quality content.
We hope you enjoy the PCB 3.0: A New Design Methodology podcast series and its companion guide.
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Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.