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The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs

01/24/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce the launch of its newest venture, The Training Connection, LLC, a company dedicated to addressing the growing need for practical and effective training in test engineering and development. With a focus on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection is poised to empower professionals with the tools and expertise they need to excel.

Delvitech Expands Into Microelectronics and Chiplet Segments

01/23/2025 | Delvitech
Delvitech, a global leader in AI-driven optical inspection technology, is proud to announce its strategic expansion into the microelectronics and chiplet sectors.

DigiKey Renews Platinum Level Sponsorship of WE United

01/23/2025 | PRNewswire
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced it has renewed its annual Platinum Level sponsorship of WE United, formerly Women in Electronics (WE).

Datest Expands Reach in Florida with Whitlock Associates Partnership

01/23/2025 | Datest
Datest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, is excited to announce the addition of Whitlock Associates to its network of sales representatives.

NAND Flash Manufacturers to Resume Production Cuts in 2025 to Ease Supply-Demand Imbalance and Stabilize Prices

01/22/2025 | TrendForce
TrendForce’s latest research report highlights that the NAND Flash industry will continue to face dual pressure from weak demand and oversupply in 2025. In response, manufacturers including Micron, Kioxia/SanDisk, Samsung, and SK hynix/Solidigm have similar plans to cut production—a move that could accelerate industry consolidation in the long term.
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