-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
TRI to Participate at the Nordic TestForum 2024
October 25, 2024 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI) will take part in the 2024 Nordic Test Forum (NTF), held at the Clarion Hotel Helsinki, Finland from November 26 - 27, 2024.
Anthony Wang, TRI's European Managing Director, will share insight on ICT for Data center, AOI for LED & AXI for Automotive Electronics.
TRI invites you to stop by Nordic Test Forum to discuss test and inspection solutions for the electronics manufacturing Industry.
Suggested Items
TRI to Host Test and Inspection Technology Seminars
01/02/2025 | TRITest Research, Inc. (TRI) is proud to announce the 2025 Technology Seminars, which will feature Innovative Inspection Solutions, SPI, AOI, AXI, and ICT solutions at a series of technology seminars and product demos held in Taiwan, Shenzhen, and Suzhou.
TRI to Exhibit Advanced Test and Inspection at IPC APEX Expo 2025
01/01/2025 | TRITest Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025. Visit TRI at booth #2905 to experience TRI's latest test and inspection solutions for the electronics manufacturing Industry.
IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference
12/30/2024 | IPCThe Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025.. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.
Kimball Electronics Thailand Namlee School
12/26/2024 | Kimball ElectronicsKimball Electronics Thailand (KETL) has continued its commitment to supporting education and community development in Thailand.
Solar Powered Aircraft Achieves New Stratospheric Success
12/26/2024 | BAE SystemsA British-led team of engineers has taken a leap forward in the race to harness the stratosphere for earth observation and communications, completing a new series of test flights of BAE Systems’ High Altitude Pseudo Satellite (HAPS) Uncrewed Aerial System (UAS), PHASA-35®, in quick succession.