-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Combatting Advanced Techniques in Counterfeiting
October 30, 2024 | Anthony BryantEstimated reading time: 1 minute

In today's interconnected global marketplace, counterfeit electronics pose a significant threat to industries ranging from aerospace and defense to healthcare and telecommunications. As counterfeiters employ increasingly sophisticated techniques, the need for robust strategies to prevent, mitigate, and identify counterfeit components has become critical. This article explores the advanced techniques used in counterfeiting, the potential involvement of state-owned enterprises (SOEs), and comprehensive strategies for combating this pervasive issue.
Advanced Techniques in Counterfeiting
Counterfeiters continually evolve their methods to produce fake electronic components that closely mimic authentic parts. Some of the most advanced techniques include:
- Re-marking and re-packaging: Altering legitimate part markings and repackaging components to misrepresent them as new or different parts.
- Exploiting supply chain vulnerabilities: Counterfeiters exploit vulnerabilities in the supply chain, introducing fake components that can go undetected until integrated into critical systems.
- Reverse engineering: This process involves disassembling genuine products to replicate their design and functionality, creating clones that are difficult to distinguish from the original.
- Use of cutting-edge technologies: Counterfeiters leverage advanced technologies like artificial intelligence (AI), 5G, and quantum computing to produce highly accurate replicas that challenge conventional detection methods.
Figure 1: Four key entry points of counterfeits into the electronic components supply chain.
The Role of State-Owned Enterprises
Chinese state-owned enterprises (SOEs) have been implicated in producing cloned counterfeit electronic parts, particularly complex semiconductor chips like fine-pitch grid arrays (FPGAs) and microcontrollers. These components are essential in high-stakes applications, including medical, military, and aerospace systems.
The cloning process often involves reverse engineering authentic products and, in some cases, intellectual property theft. SOEs possess advanced manufacturing technologies that allow them to produce high-quality counterfeit components, making it challenging to distinguish between genuine and cloned parts. The involvement of SOEs is particularly concerning due to their access to advanced manufacturing technologies and potential for large-scale operations.
To read the entire article, which original published in the October 2024 SMT007 Magazine, click here.
Suggested Items
Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years
06/26/2025 | Count On ToolsCount On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
06/26/2025 | ECTCThe 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.