Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
DuPont Earns Best Partner Award for Innovation from Samsung Electronics
October 31, 2024 | DuPontEstimated reading time: 1 minute
DuPont announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category. The award recognizes DuPont’s development of polishing pads for advanced semiconductor fabrication and was presented at Samsung’s third annual Material-day (M-day) event.
Organized by Samsung Electronics' Materials Technology Group, M-day gathers semiconductor material suppliers and other supply chain partners to discuss materials and technology trends and celebrate outstanding achievements.
DuPont is an innovation leader in polishing pads, slurries and advanced cleans for chemical mechanical planarization (CMP) and continues to invest in the development of new products and features, including offerings for emerging technical performance needs, process efficiency and sustainability. Products such as CMP pads in the Ikonic™ pad family are enabling effective and consistent polishing of semiconductor wafers at the most advanced technology nodes, supporting semiconductor industry advancement for technologies including artificial intelligence (AI), 5G, and data centers.
“Innovation is a collaborative effort, where insight into process requirements and feedback from customers drives product development and optimization,” said Sanjay Kotha, Global Business Director, CMP Technologies, DuPont Electronics & Industrial. “We are honored to be selected for the Best Partner Award for innovation in CMP pads and truly value our relationship with Samsung Electronics. This recognition represents success for our team both for the technical achievements and for the strong collaboration, reflecting our commitment to be a Partner of Choice to our customers.”
At the 2023 M-day event, DuPont was honored by Samsung Electronics with the Best Partner Award in the Environmental, Social and Governance (ESG) category for contributions in establishing a sustainable supply chain by collaborating to develop more sustainable semiconductor materials.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.