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Atotech to Participate at KPCA Show 2024

09/03/2024 | Atotech
MKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.

Real Time with… THECA 2024: State of the Art Copper Adhesion

08/09/2024 | Real Time with... THECA
Bruce Lee, MacDermid Alpha Electronics Solutions, joined Nolan Johnson following his paper presentation on the show's mainstage. Lee provided a detailed overview of the current state of adhesion promoters and discussed the interaction between mechanical adhesion, chemical adhesion, signal integrity, and substrate impacts.

MKS’ Atotech to Participate at Semicon Europa 2022

11/02/2022 | Atotech
MKS’ Atotech will be exhibiting at Semicon Europa and present its latest results on Cu-to-Cu direct bonding for 3D integration during Advanced Packaging Solutions Conference (APC) in Munich on November 16 from 11:50 a.m. – 12:10 p.m. (room 14c; presenter: Ralf Schmidt, R&D Manager Semiconductor).

Trouble in Your Tank: Success in Photolithography Starts With Surface Preparation

11/09/2022 | Michael Carano -- Column: Trouble in Your Tank
The photolithography process defines the circuitry on the panel. As one may surmise, the imaging process used in the fabrication of high density and ultra high-density circuity has made significant advances over the last decade—and just in time. With finer lines and spaces as well as more attention to fabrication of printed wiring advanced packaging substrates. However, as is so true of many of the processes in PWB fabrication, up and down stream processes can and will influence what happens in a particular process.

MacDermid Alpha Launches ALPHA HiTech AD13-9910B Ultra-Low Temperature Adhesive

08/11/2022 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates.
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