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Advanced Electronics Packaging Digest

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Teledyne Qioptiq Receives $21M+ Germany Order for PHOENIX-XR Thermal Sights

09/04/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne Qioptiq has received the first option from the German Bundeswehr for PHOENIX-XR cooled weapons sights valued at more than $21 million.

NOTE Secures SEK 160 Million Security & Defense Contract

09/04/2026 | NOTE
NOTE has been awarded a contract by a European customer in the Security & Defense sector, with an estimated order value of approximately SEK 160 million over a three-year period. Order intake to date indicates a higher delivery rate than initially planned.

Zollner, Avalon Technologies Form India Electronics Manufacturing JV

09/04/2026 | Zollner Elektronik AG
Zollner Elektronik AG and Avalon Technologies Limited are establishing a strategic joint venture for printed circuit board assembly and system integration in India.

Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart

09/04/2026 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart.

SMTA International Announces Keynote Speakers Exploring AI, Hybrid Electronics and the Future of Manufacturing

09/04/2026 | SMTA
The SMTA announced several keynote presentations taking place during the SMTA International Conference & Exposition, October 25 - 29, 2026 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
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