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I-Connect007 Releases The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs by Martyn Gaudion

01/23/2025 | I-Connect007
I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs, authored by Martyn Gaudion of Polar Instruments. This invaluable resource offers essential insights for anyone involved in the design, procurement, or fabrication of high-speed impedance or insertion loss-controlled PCBs, as well as complex HDI PCBs requiring precise documentation.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4

01/02/2025 | I-Connect007
In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.

Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer

12/23/2024 | EINPresswire.com
Thailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.

IPC Releases Latest List of Standards and Revisions

12/17/2024 | IPC Community Editorial Team
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.

Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award

12/11/2024 | Nano Dimension
Nano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.
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