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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics

05/07/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.

Dixon, Inventec Form JV for PC Manufacturing in India

05/05/2025 | Dixon
Dixon has entered into Joint Venture Agreement (JV Agreement) with Inventec. Pursuant to the said JV Agreement, Dixon IT Devices Private Limited (JV Company) will be 60% owned by Dixon and 40% owned by Inventec.

INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b

04/28/2025 | iNEMI
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.

Bosch Establishes Company with Element Six

04/08/2025 | Bosch
They cannot be grasped, either literally or figuratively. Yet their potential is revolutionary, and they are a key technology of the future. We are talking about quanta.

Thales Joins IMC to Strengthen IoT Security and Connectivity

03/10/2025 | Thales
Thales has joined the IoT M2M Council (IMC), marking a significant step forward in our mission to enhance awareness around the vital importance of digital device connectivity and security.
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