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PAC-3 Engages Advanced Target in Flight Test Supporting U.S. Army Modernization Strategy
November 5, 2024 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin’s Patriot Advanced Capability – 3 (PAC-3) missile successfully integrated with Raytheon’s Lower Tier Air and Missile Defense Sensor (LTAMDS) radar to defeat an advanced Tactical Ballistic Missile (TBM). The test validated advanced software updates that ensures PAC-3 can defeat evolving threats within the U.S. Army’s modernized Integrated Air and Missile Defense (IAMD) architecture.
During the flight test at White Sands Missile Range, PAC-3 Missile Segment Enhancement (MSE) and Cost Reduction Interceptor (CRI) confirmed the ability to detect, acquire, track and engage an advanced TBM target. The interceptors were shot in a ripple configuration and successfully engaged and intercepted the TBM target.
“Integrating PAC-3 with new, advanced systems to deliver next-generation deterrence capability is a critical piece of the U.S. Army’s modernization strategy,” said Brian Kubik, vice president of PAC-3 Programs. “This is 21st Century Security® in action – by harnessing digital technologies to network platforms together, Lockheed Martin is increasing the effectiveness and deterrent value of defense solutions for our customers, ensuring they have the technology needed to stay ahead in an evolving threat environment.
To prepare for today’s flight test, Lockheed Martin partnered with the U.S. Army to conduct a series of ground testing and captive carry tests. This builds upon previously demonstrated PAC-3 capability with the U.S. Army’s Integrated Battle Command System (IBCS) and LTAMDS radar.
PAC-3 uses Hit-to-Kill technology to defend against threats through direct body-to-body contact that delivers exponentially more kinetic energy on the target than can be achieved with blast-fragmentation mechanisms. PAC-3 is effective against current and evolving threats including aircraft, tactical ballistic missiles, advanced threats including hypersonics, and cruise missiles.
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IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
03/05/2025 | Marcy LaRont, I-Connect007It was a cool and sunny morning as I headed out to the IMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. IMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.