Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
Koh Young Technology Showcasing its Inspection Solutions at NEPCON ASIA in Shenzhen
November 6, 2024 |Estimated reading time: 2 minutes
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, demonstrates its award-winning inspection solutions at NEPCON Asia from November 6-8, 2024, in booth 9E10 at the Shenzhen World Exhibition & Convention Center. With a focus on innovative technologies and advanced solutions for circuit board assembly, semiconductor packaging, and smart factories, our engineers will demonstrate solutions to solve your challenges.
Koh Young experts will demonstrate how our Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and Dispensed Material Inspection (DPI) solutions can enhance your production quality and yield, especially when combined with our KSMART software solutions like KPO, KAP, and Smart Review. We will be highlighting several systems uniquely positioned to provide solutions for challenges from circuit board assembly to advanced package and semiconductor inspection:
Zenith Nova The new Zenith Nova is a True 3D AOI Solution powered by artificial intelligence and machine learning, combining the best mechatronics and algorithm technologies to deliver outstanding performance without sacrificing accuracy.
KY8030 Nova Delivering an ideal mix of cost and performance for solder paste inspection, the new KY8030 Nova provides the best value for a varied set of application needs demanding enhanced quality, increased productivity, and better operational efficiency.
Neptune C+ Protect your electronics with confidence. Koh Young’s patented L.I.F.T. technology (Laser Interferometry for Fluid Tomography) ensures precise, non-destructive 3D inspection of conformal coatings and other dispensed materials, whether wet or dry.
Meister S Qualified by leading semiconductor foundries and Mini/Micro-LED companies, the Meister S delivers full 3D inspection for micro solder and flux inspection applications, combining high-resolution optics with innovative vision algorithms.
Meister D+ Breakthrough True 3D inspection technology for high-density substrates and highly reflective components. The Meister D+ leverages Koh Young’s new proprietary optics and Moiré technology to achieve accurate 3D inspection of mirror-finish reflective dies and challenging surfaces.
KSMART Maximizing production efficiency by combining industry standards with AI engines to go beyond simple machine connectivity and open the gates to a smart factory to everyone.
KPO (Koh Young Process Optimization) Based on Koh Young’s accurate True 3D measurement data and its proprietary deep learning technology, KPO analyzes defects and enables real-time process optimization.
KAP (Koh Young Auto-Programming) Industry-leading 3D profilometry technology converges with Koh Young’s proprietary AI technology to deliver true automatic programming. The innovative geometry-based Koh Young Auto Programming (KAP) software solution reduces the programming process to minimize production preparation and reduces costs.
Smart Review Combining proprietary vision algorithms with a learning-based AI engine from Koh Young, the Smart Review system reduces false calls and operator intervention by automatically assessing OCV and OCR readings. By minimizing false calls, the Smart Review system increases line operator efficiency and boost production line utilization to reduce overall costs. The system also maximizes production performance by reviewing defects from multiple lines, offering judgment history and the help cards with auto-classified defect information.
For more information about how Koh Young’s award-winning solutions can elevate your production quality and solve your most challenging inspection needs, visit us at NEPCON Aisa Booth A3.358 or SEMICON Europa Booth C2.549. Do not miss this opportunity to engage with our experts, experience our innovative technologies firsthand, and discover how we can help you achieve new levels of efficiency in your manufacturing processes.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.