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Empower Semiconductor Showcases Cutting-Edge Vertical Power Architecture for AI and HPC Processors at electronica 2024
November 6, 2024 | Empower SemiconductorEstimated reading time: 1 minute
Empower Semiconductor, the world leader in integrated voltage regulators (IVRs), will demonstrate its new Crescendo platform with FinFast™ technology at electronica 2024, the world’s leading trade fair and conference for electronics. Experience the first demonstration in Europe of scalable true vertical power for artificial intelligence (AI) and high-performance computing (HPC) by visiting Empower Semiconductor (Dimac Red S.p.A.) at Hall B4, Booth #110 on the show floor at the Messe München, November 12-15, 2024.
The Crescendo platform – a scalable on-demand true vertical power architecture for upwards of 3,000A power domains – integrates all power components in a single device thin enough to relocate underneath the processor and supply on-demand kilowatt power with unmatched speed and accuracy. It eliminates virtually all capacitor banks, shrinking board space by 5x and reducing system power losses by up to 20%.
Designed to address the pressing power delivery challenges of AI processors, Crescendo harnesses Empower’s FinFastTM technology to offer a unique integration of advanced silicon processes, magnetics and silicon capacitors with breakthrough control architectures in a thermally-efficient power package.
“Bringing Crescendo to electronica is an important and proud milestone for Empower,” stated Eric Pittana, senior director of global marketing and EMEA sales for Empower Semiconductor. “Following the strong reception we received during the unveil in the U.S. market in October, we’re eager to demonstrate to our European customers how Crescendo is the answer to their kilowatt-range power delivery problem.”
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Julia McCaffrey - NCAB GroupSuggested Items
Aismalibar North America Showcases Advanced Thermal Management Solutions at The Battery Show North America 2025
09/18/2025 | AismalibarAismalibar North America, a leader in high-performance thermal management solutions, will present its latest innovations at The Battery Show North America and Electric & Hybrid Vehicle Technology Expo 2025 in Detroit, Michigan, October 6–9, 2025, where attendees can meet the team at Booth #5929 to explore materials engineered for demanding EV and high-power electronics.
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.
Hitachi Unveils $1B U.S. Investment in Critical Grid Infrastructure
09/05/2025 | Hitachi EnergyHitachi Energy, a wholly owned subsidiary of Hitachi, Ltd., and global leader in electrification, today announced a historic investment of more than $1 billion USD to expand the production of critical electrical grid infrastructure in the United States.
Wisdom From Data-center Power Pioneer Mike Mosman
09/02/2025 | Barry Matties, I-Connect007Few engineers have moved the levers of modern electronics more decisively than Mike Mosman. From the pre-email computer rooms of the 1980s to today’s hyperscale campuses cranking out AI cycles, the retired power engineer and co-founder of CCG Facilities Integration has spent four decades proving that uptime is a design discipline, not a hope.