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Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States

01/28/2025 | Koh Young
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry.

Takaya Launches High-Precision Flying Probe Test System at APEX 2025

01/27/2025 | Takaya
TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, will launch the company’s new APT-2400F/APT-2600FD Series flying probe tester in Booth #3530 at the IPC APEX Expo March 18 – 21, 2025 at the Anaheim (CA.) Convention Center.

Delvitech Expands Into Microelectronics and Chiplet Segments

01/23/2025 | Delvitech
Delvitech, a global leader in AI-driven optical inspection technology, is proud to announce its strategic expansion into the microelectronics and chiplet sectors.

iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection

01/23/2025 | iNEMI
Register today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.

TRI at TMS Electronic Announces Open Day Event

01/20/2025 | TRI
TMS Electronic, TRI's distributor, is excited to invite industry professionals, partners, and clients to its Open Day Event (Jornada de Puertas Abiertas), taking place from February 11-13, 2025, in Barcelona, Spain.
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