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Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process
November 8, 2024 | Michelle Te, IPC CommunityEstimated reading time: 1 minute
PCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.
“It’s a platform where the European electronics design community can meet, exchange ideas, and get updates on state-of-the-art knowledge and ongoing developments,” says Peter Tranitz, senior director, solutions, IPC Electronics Europe GmbH. “This format has been asked for by industry leaders in the course of the discussions with our European policy meetings in Brussels, when the European Chips Act was close to being passed.”
PEDC is co-hosted by IPC Europe and FED, the German electronics design and manufacturing association, with marketing support from IPC and I-Connect007. It is designed to connect the European EE industry and the scientific community. It includes two days of lectures and expert panels in two parallel thematic blocks on technologies and processes for the development and production of electronic assemblies and systems. There will also be a keynote and an evening networking event.
Topics will include development, design for excellence, software and tools, and the design process of electronic systems. All presentations will be in English.
“Our aim with this format is to bring the industry together and offer a platform for exchanging knowledge,” says Christoph Bornhorn, executive director of FED. “Experts meet, exchange ideas, and network on an international level. This can result in projects and innovations that ultimately benefit the entire industry.”
Continue reading this article in the Fall 2024 issue of IPC Community.
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