Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

ESCATEC Pushes New Boundaries in Micro-electronics with UV Enhanced Die Bonder Technology

10/30/2024 | ESCATEC
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

Dymax to Showcase Expanding Range of Light-Cure Solutions for Electronics at SMTA International 2024

10/03/2024 | Dymax
Dymax, a leading manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2024 in Rosemont, IL, from October 21-24.

Altus, Danutek Announce Strategic New Partnership with actnano

08/19/2024 | Altus Group
Altus Group and its sister company Danutek, renowned suppliers of capital equipment and service support to the electronics manufacturing sector, are pleased to announce their new partnership with actnano, a global leader in surface protection technologies.

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 2

07/03/2024 | I-Connect007 Editorial Team
There are many important things to consider when applying an encapsulant. Chapter 2 of this book is an overview of the application process that covers many of the terms and definitions found on a technical data sheet and discusses the primary considerations for each of the process stages. It is worthwhile considering some of the terms and definitions found on a technical data sheet to understand how the different liquid, mixed system, and cured property values can dictate the method chosen to apply materials.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in