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Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
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SIA Statement on Election Results
November 8, 2024 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding this week’s election results.
“We congratulate President-elect Trump, Vice President-elect Vance, and new and returning members of Congress. Policymakers from both parties recognize a strong domestic chip industry is critical to America’s economic strength, national security, technology leadership, and global competitiveness. We look forward to working with the White House and Congress to advance policies that ensure the U.S. remains the global leader in semiconductor research, design, and manufacturing to drive the technologies of the future.”
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