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ASMPT Makes High-strength and High-conductivity Joints Possible with Silver Sintering

07/30/2024 | ASMPT
ASMPT, the world’s leading provider of hardware and software for semiconductor and electronics production, presents an innovative die and module bonding platform that can be used in a variety of ways for producing power modules.

Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM

05/17/2024 | Indium Corporation
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.

MacDermid Alpha's Sintering Technologies Take Center Stage at PCIM Asia

08/29/2023 | MacDermid Alpha
MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023.

MacDermid Alpha Presents at PCIM Europe

05/02/2023 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023.

MacDermid Alpha Electronics Solutions Expands its Argomax Sintering Technologies

04/04/2023 | MacDermid Alpha Electronics Solutions
MacDermid Alpha, one of the world’s largest providers of circuitry, assembly, and semiconductor solutions for electronics manufacturers, has expanded the Argomax® technology offering. Argomax® 2148 is a new silver sintering product, designed for electric vehicle power inverters.
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