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With great excitement we announce to have signed a license agreement with NANO-JOIN GmbH to use their sintering technology and integrate it into our ECORELTM SINTEC product line. Under this brand we will manufacture and commercialize their products. With this cooperation we believe to integrate many more developments into our product range.
For over 10 years Nano-Join has been focusing on the development of cutting-edge sintering solutions. Their portfolio covers materials for applications from pressure less die-attach to large area pressure assisted module attach and many more. With years of experience in process development at customer sites they have an extensive knowledge of implementing sintering solutions in tight production windows. This makes them now one of the most experienced companies in this field and already rewarded with several qualifications at renowned customers.
Based on our years of experience in developing & the industrialization of our own formulated solder products, Inventec is well placed to bring Nano-join’s technology to a wide and global customer base. Not only do we guarantee stable and uniform quality but also our Sales & Technical Support are there to assists in the implementation, regardless of location
"We already worked for several years on reliable interconnection products and with this license agreement, we can now accelerate deployment of our sintering solutions for the semicon and power electronics industry," says Anne-Marie Laügt, - VP Strategic Technology Innovation at Inventec Performance Chemicals.
"As a Germany-based deep-tech provider, we have long sought a scale-up licensing partner within Europe. With this agreement, we now have a partner who will not only produce our offerings across Europe but bring them to a global stage. This collaboration provides a powerful endorsement that our products are here to stay, delivering the performance boost companies have been searching for," says Dr. Battist Rábay, CEO of Nano-Join GmbH.
Sintering solutions are used as an alternative to solder paste in applications where high thermal and electrical conductivity, reliability, and mechanical strength are critical. Some key areas where sintering is preferred include lead free die-attach, large area module attach, E-Vehicle, Energy conversion of Renewable energies, Optoelectronics and RF power devices. Especially with the latest SiC and GaN developments operating at much higher power, using sintering interconnections with higher thermal and excellent electrical conductivity is crucial.
