-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Inventec Performance Chemicals and Nano-Join are Teaming Up to Deliver Sintering Solutions
November 8, 2024 | SMTAEstimated reading time: 1 minute
With great excitement we announce to have signed a license agreement with NANO-JOIN GmbH to use their sintering technology and integrate it into our ECORELTM SINTEC product line. Under this brand we will manufacture and commercialize their products. With this cooperation we believe to integrate many more developments into our product range.
For over 10 years Nano-Join has been focusing on the development of cutting-edge sintering solutions. Their portfolio covers materials for applications from pressure less die-attach to large area pressure assisted module attach and many more. With years of experience in process development at customer sites they have an extensive knowledge of implementing sintering solutions in tight production windows. This makes them now one of the most experienced companies in this field and already rewarded with several qualifications at renowned customers.
Based on our years of experience in developing & the industrialization of our own formulated solder products, Inventec is well placed to bring Nano-join’s technology to a wide and global customer base. Not only do we guarantee stable and uniform quality but also our Sales & Technical Support are there to assists in the implementation, regardless of location
"We already worked for several years on reliable interconnection products and with this license agreement, we can now accelerate deployment of our sintering solutions for the semicon and power electronics industry," says Anne-Marie Laügt, - VP Strategic Technology Innovation at Inventec Performance Chemicals.
"As a Germany-based deep-tech provider, we have long sought a scale-up licensing partner within Europe. With this agreement, we now have a partner who will not only produce our offerings across Europe but bring them to a global stage. This collaboration provides a powerful endorsement that our products are here to stay, delivering the performance boost companies have been searching for," says Dr. Battist Rábay, CEO of Nano-Join GmbH.
Sintering solutions are used as an alternative to solder paste in applications where high thermal and electrical conductivity, reliability, and mechanical strength are critical. Some key areas where sintering is preferred include lead free die-attach, large area module attach, E-Vehicle, Energy conversion of Renewable energies, Optoelectronics and RF power devices. Especially with the latest SiC and GaN developments operating at much higher power, using sintering interconnections with higher thermal and excellent electrical conductivity is crucial.
Suggested Items
ASMPT Makes High-strength and High-conductivity Joints Possible with Silver Sintering
07/30/2024 | ASMPTASMPT, the world’s leading provider of hardware and software for semiconductor and electronics production, presents an innovative die and module bonding platform that can be used in a variety of ways for producing power modules.
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
05/17/2024 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
MacDermid Alpha's Sintering Technologies Take Center Stage at PCIM Asia
08/29/2023 | MacDermid AlphaMacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Asia, held at Shanghai New International Expo Center - SNIEC, 29 - 31 August 2023.
MacDermid Alpha Presents at PCIM Europe
05/02/2023 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023.
MacDermid Alpha Electronics Solutions Expands its Argomax Sintering Technologies
04/04/2023 | MacDermid Alpha Electronics SolutionsMacDermid Alpha, one of the world’s largest providers of circuitry, assembly, and semiconductor solutions for electronics manufacturers, has expanded the Argomax® technology offering. Argomax® 2148 is a new silver sintering product, designed for electric vehicle power inverters.