The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
November 8, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
In our industry we work on solutions. This week, solutions are represented in these must-read choices. Solid state batteries make an appearance, as does LED imaging equipment at American Standard Circuits. SPEA’s AI-based optical inspection is here, as are Happy Holden’s recent article on one key engineering skill and news about a flagship R&D facility funded by the U.S. CHIPS Act.
Real Time with... SMTAI 2024: John Johnson on American Standard Circuits' Advanced Technology
Published November 6
In this interview from SMTAI 2024, American Standard Circuits' John Johnson details a conversation that starts with the news of a new LED imager and pivots to a peek into American Standard's capabilities roadmap for the next three years. Click to listen now.
Biden-Harris Administration to Invest $825 Million in First CHIPS for America R&D Facility
Published November 1
The Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility—within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.
Solid-State Batteries Enter Pilot Production, Costs Expected to Drop to CNY 0.6–0.7/Wh by 2035
Published November 1
Battery technology not only continues to develop but is accelerating, according to TrendForce. Learn more about how SSBs will change in the next 10 years.
Real Time with... SMTAI 2024: SPEA Brings Added Sophistication to Board Testing Capabilities
Published November 5
Nolan Johnson spoke with Luca Fanelli from SPEA at SMTAI 2024. In this interview, Fanelli describes SPEA's new AI-based optical inspection technology and shares a powerful example from the field. He also updates Nolan Johnson on SPEA's organizational growth meant to improve customer value. Click here to listen.
Root-cause Analysis and Problem-solving
Published November 1
Happy Holden’s article in October’s PCB007 Magazine pulls from more detailed information in his book, 24 Essential Skills for Engineers, the books section). If your job involves problem solving and root cause analysis, it’s a useful read. And check out the book, too.
Share on:
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.