Bloom Energy, Quanta Computer Expand Partnership to Power AI Revolution
November 11, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Bloom Energy, a world leader in solid oxide fuel cell (SOFC) technology, and Quanta Computer Inc., a premier Taiwanese electronics manufacturer, announced a major expansion of an existing agreement to power the production of critical hardware serving the AI industry. The new agreement increases the power capacity of Quanta’s existing Bloom SOFC installation by more than 150 percent and will circumvent a costly utility interconnection delay to keep up with rapidly growing demand for orders.
AI is one of the fastest growing technologies today that is reshaping industries and poised to be a major economic driver worldwide. Most AI data centers are located in the United States and demand for Quanta servers to support these facilities is quickly increasing, requiring access to reliable power – which is a challenge in Silicon Valley where both real estate and grid power are severely constrained.
When Quanta’s manufacturing expansion in Fremont was impeded by costly interconnection delays to the local electric utility, they turned to an islanded Bloom Energy SOFC microgrid installation to reliably deliver the power it needed to serve the fast-paced AI sector.
As demand for Quanta’s products continues to grow, the company decided to expand its Bloom microgrid solution.
“Leaders in the AI industry like Quanta simply do not enjoy the luxury of being able to wait for traditional grid infrastructure, because the marketplace won’t wait for them,” said Aman Joshi, Bloom Energy’s global Chief Commercial Officer. “Bloom’s SOFC microgrids provide AI customers with a flexible, pay-as-you-grow solution that is ready to scale and avoids additional transmission or distribution upgrades. This effectively shortens interconnection permitting associated with traditional infrastructures.”
Bloom is on-track to deliver the expanded power capacity for Quanta ahead of schedule early next year, demonstrating significant Time to Power advantages Bloom’s solution offers over the grid. The expansion of this partnership will create Bloom’s largest islanded, load-following industrial installation.
Bloom’s microgrid solution will continue to address Quanta’s short- and long-term needs for energy and provide resilience to unplanned power outages and predictability in energy costs.
Suggested Items
Würth Elektronik Offers its Radio Module for LoRaWAN Communication
11/19/2024 | Wurth ElektronikWürth Elektronik launches Daphnis-I on the market – a slim, ultra-low power consumption and long range radio module for IoT applications.
RTX's Raytheon Awarded U.S. Army Contract for Wireless Power Beaming Technology
11/18/2024 | Raytheon TechnologiesRaytheon, an RTX, has been awarded a contract from the U.S. Army to work on directed energy wireless power beaming capabilities that will distribute power across the battlefield, simplify logistics, and safeguard locations for U.S. troops.
Boeing Delivers Advanced O3b mPOWER Satellites to Operator SES
11/14/2024 | BoeingBoeing teams have successfully delivered the 7th and 8th O3b mPOWER satellites to SES. These satellites, featuring Boeing’s advanced software-defined communications payload, are being transported to Cape Canaveral for a planned launch in December.
Renesas Jointly Developed World-Class '8-in-1' Proof of Concept with Nidec
11/12/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the world's first “8-in-1” proof of concept* (PoC) for E-Axle systems for electric vehicles (EV), which controls eight functions using a single microcontroller (MCU).
Aismalibar to Showcase Advanced Thermal Management Solutions for Electronics at electronica 2024
11/11/2024 | AismalibarAismalibar, a leading innovator in thermal management solutions, will exhibit at electronica 2024, the world’s foremost trade fair and conference for the electronics industry, held in Munich from November 12-15, 2024. Located at Booth B1.543, Aismalibar will highlight its latest advancements in Thermal Interface Materials (TIMs), Insulated Metal Substrates (IMS), and Thermal FR4 solutions tailored to meet the increasing demands for efficient heat dissipation and durability across various high-power applications.