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Aismalibar, a leading innovator in thermal management solutions, will exhibit at electronica 2024, the world’s foremost trade fair and conference for the electronics industry, held in Munich from November 12-15, 2024. Located at Booth B1.543, Aismalibar will highlight its latest advancements in Thermal Interface Materials (TIMs), Insulated Metal Substrates (IMS), and Thermal FR4 solutions tailored to meet the increasing demands for efficient heat dissipation and durability across various high-power applications.
Electronica, held biennially, gathers global technology leaders to showcase cutting-edge developments and forge strategic partnerships within the electronics industry.
Featured Product Highlights
- Thermal Interface Materials (TIMs): Aismalibar will introduce its new generation of high-performance TIMs, BOND SHEET CURED GLASS FREE, which provide outstanding thermal conductivity and durability, critical for the growing needs of high-power-density applications. These materials are designed to bridge gaps between heat-generating components and heatsinks, ensuring optimal heat dissipation in EV battery packs and other high-performance electronics.
- Thermal FR4 (CCLs): HTC 3.2w HIGH TG BOND SHEETS AND THIN LAM are used in PCB manufacturing to improve thermal management and reduce thermal vias. The use of Aismalibar's thermal FR4 can reduce the operating temperature of power components by up to 20%, which will result in improved output and extended lifespan.
- Insulated Metal Substrates (IMS): Aismalibar will also feature its latest IMS solutions, COBRITHERM ULTRATHIN 5W and 8W, designed for applications requiring both electrical insulation and efficient thermal conductivity. These substrates are ideal for power electronics, enabling manufacturers to manage higher power outputs without compromising system stability or lifespan.
Aismalibar’s expert team will be available at Booth B1.543 to discuss its comprehensive range of thermal management solutions and how these innovations support the performance and reliability of high-power electronic applications.
