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Aismalibar to Showcase Advanced Thermal Management Solutions for Electronics at electronica 2024
November 11, 2024 | AismalibarEstimated reading time: 1 minute
Aismalibar, a leading innovator in thermal management solutions, will exhibit at electronica 2024, the world’s foremost trade fair and conference for the electronics industry, held in Munich from November 12-15, 2024. Located at Booth B1.543, Aismalibar will highlight its latest advancements in Thermal Interface Materials (TIMs), Insulated Metal Substrates (IMS), and Thermal FR4 solutions tailored to meet the increasing demands for efficient heat dissipation and durability across various high-power applications.
Electronica, held biennially, gathers global technology leaders to showcase cutting-edge developments and forge strategic partnerships within the electronics industry.
Featured Product Highlights
- Thermal Interface Materials (TIMs): Aismalibar will introduce its new generation of high-performance TIMs, BOND SHEET CURED GLASS FREE, which provide outstanding thermal conductivity and durability, critical for the growing needs of high-power-density applications. These materials are designed to bridge gaps between heat-generating components and heatsinks, ensuring optimal heat dissipation in EV battery packs and other high-performance electronics.
- Thermal FR4 (CCLs): HTC 3.2w HIGH TG BOND SHEETS AND THIN LAM are used in PCB manufacturing to improve thermal management and reduce thermal vias. The use of Aismalibar's thermal FR4 can reduce the operating temperature of power components by up to 20%, which will result in improved output and extended lifespan.
- Insulated Metal Substrates (IMS): Aismalibar will also feature its latest IMS solutions, COBRITHERM ULTRATHIN 5W and 8W, designed for applications requiring both electrical insulation and efficient thermal conductivity. These substrates are ideal for power electronics, enabling manufacturers to manage higher power outputs without compromising system stability or lifespan.
Aismalibar’s expert team will be available at Booth B1.543 to discuss its comprehensive range of thermal management solutions and how these innovations support the performance and reliability of high-power electronic applications.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.