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TRI at SMTA Silicon Valley Expo & Tech Forum 2024
November 12, 2024 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will join the SMTA Silicon Valley Expo & Tech Forum 2024 on December 5, 2024, at the Fremont Marriott Silicon Valley.
Visit TRI's stand to discuss how TRI's One Stop Solution for PCB Assembly Testing (ICT and MDA) and Inspection (SPI, AOI, and AXI) can enhance your production's yield.
TRI's cutting-edge Optical Inspection and Test solutions optimize electronics manufacturing and the Semiconductor and Advanced Packaging Industry through AI-powered Inspection algorithms, multiple 3D technologies, metrology measurements, and more advanced defect detection features.
TRI's Test and Inspection platforms enable big data and data traceability, essential for a Smart Factory environment. TRI's solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX).
Join us at the SMTA Silicon Valley Expo 2024 to discover why the top EMS businesses chose TRI as their Test and Inspection Partner.
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Rachael Temple - AlltematedSuggested Items
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
Teledyne FLIR Defense to Deliver Portable Chemical Detectors to US Customs and Border Protection
10/21/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has received an order from U.S. Customs and Border Protection (CBP) for 15 of its Griffin™ G510x portable chemical detectors, specifically designed to analyze and identify explosives and narcotics, such as fentanyl and nitazenes, within five minutes.
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.