Happy’s Tech Talk #37: New Ultra HDI Materials
It’s Only Common Sense: When Data Isn’t Enough, Trust Your Gut
Marcy’s Musings: Fueling the Workforce Pipeline
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
November 12, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Our speaker, Bob Bouchard of BTU International, will be giving his presentation, Solder Reflow Oven Fundamentals and Thermal Profiling Approaches. This presentation will provide a comprehensive overview of reflow oven technology, covering essential topics such as heating methods, atmosphere control, hardware configurations, and forced convection, all in relation to meeting specific reflow process requirements. We will also explore the critical role of thermal profiles, how to align them with solder paste manufacturers' specifications, general profiling approaches, and process monitoring tools. Attendees will gain practical insights into key aspects of the PCB manufacturing process for reflow soldering, equipping them with the knowledge needed to optimize and enhance their processes.
This session benefits SMT engineers, process managers, and production supervisors working in PCB manufacturing. Attendees will better understand reflow soldering processes, allowing them to optimize oven settings, enhance production consistency, and reduce defects. By mastering these concepts, participants will be better equipped to troubleshoot issues, improve yield, and maintain high standards in soldering quality.
Register at SMTA website.
About Presenter, Bob Bouchard:
Bob is the Director of Sales and Marketing - Americas for BTU International. He has been with BTU in various technical, marketing and sales roles at BTU for over 30 years. While spending much his career in product development and product management, Bob Has been in the industry since the mid 1990’s involved with many thermal applications and processes including SMT reflow, curing, semiconductor packaging, solar cells and other high temperature applications such as brazing, sintering and hybrid electronics.
Share on:
Suggested Items
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Incap India Invests in New SMT Technology
01/24/2025 | IncapIncap India has invested approximately EUR 1 million in a new SMT (surface-mount technology) production line at its third factory in Tumkur.
Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
01/22/2025 | Indium CorporationIndium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.