Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
International Electronics Circuit Exhibition (Shenzhen) Coming Dec. 4–6
November 14, 2024 | Edy Yu, I-Connect007Estimated reading time: 6 minutes
HKPCA hosts the 22nd annual International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show), Dec. 4-6, at the Shenzhen International Convention and Exhibition Center (Bao’an) in Halls 5, 6, 7, and 8. With more than 600 global brands and emerging companies, it is one of the world's largest gatherings for the circuit board and electronic assembly industry. The theme of the event is "AI Powers the Future." It will focus on AI, high-end PCBs, high-performance materials, smart automation, and other hot topics. It will showcase innovative processes and technologies across the PCB and PCBA industry chain, bringing together global elites and resources to drive ongoing development.
We recently spoke with the show’s organizers to discuss show highlights and future industry trends.
Edy Yu: Please introduce the theme of this year’s exhibition and its significance for our industry.
HKPCA: With the continuous progress of artificial intelligence, the industry is facing an urgent need for transformation and upgrade. To reflect the trend, this year’s exhibition theme is "AI Powers the Future." In this context, manufacturers can improve production efficiency, optimize resource allocation, and facilitate intelligent management utilizing AI technology. This not only meets the market's demand for smart products but also helps companies maintain a competitive edge globally. "AI Powers the Future" represents a proactive response to technology trends and serves as a strategic guide for the future of the industry.
What are the highlights of this year's exhibition in terms of exhibitor lineup, audience size, and internationalization?
This will be our 22nd year of the show. With the wave of AI advancements, the exhibition will be on an even larger scale with a very strong lineup of exhibitors who will showcase an even more extensive breadth of products. This will attract more attendees from the PCB, PCBA, and end-manufactor industries.
The exhibition will use Halls 5, 6, 7, and 8 of Shenzhen International Convention and Exhibition Center (Bao’an), covering an exhibition area of 80,000 square meters, with seven major pavillions to comprehensively display the latest products and technologies across the PCB and PCBA industry chain.
This year’s exhibition brings together over 600 top global brands, with more than 70 first-time exhibitors and over 3,500 booths. Notable exhibitors include TTM, JOVE-Juchen Circuit, Topsearch, Shenzhen SprintPCB, LM Electronics, Schmoll, ADVANCED MICRO, Lian Qun, Dawn Sun, Protek, C Sun, YSPHOTEC, TZTEK, KSDW, Fang Tai, World Wide Group, BAIKAL, UCE Group, MACHVISION, CFMEE, JIEJUN ELECTRONICS, SCREEN, KLA, LST, SAA, WKK, Zhen Tianwei, HARWAR ChemoTech, SHINBU, Asian Electroplating, VEGA, Kingboard, GHTECH, XACT, YAYA Technology, KUANGSHUN, CHEON WESTERN, Carl Zeiss, OPTON, Amiba, KPEA and more.
How have you approached international business cooperation and globalization this year?
Last year’s exhibition attracted attendees from 44 countries and regions. This year, we are actively collaborating with overseas medium, international organizations, and related institutions to increase the exhibition’s visibility and appeal in the global market.
Page 1 of 2
Share on:
Suggested Items
Hanon Systems Wins Third PACE Award for Visible-Light LED Photocatalyst Technology
04/18/2025 | PRNewswireHanon Systems, a leading global automotive thermal management supplier and subsidiary of Hankook & Company Group, has been named a winner of the 2025 PACE Awards. This marks the company's third win, making it the first Korean supplier to achieve this recognition.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Can the Electronics Industry Balance Tariffs With Investment?
04/18/2025 | I-Connect007 Editorial TeamTo better understand the U.S. administration’s recent actions on global trade policies, Barry Matties and Nolan Johnson met with Richard Cappetto, IPC’s senior director of North American government relations, who highlighted both the challenges and opportunities available to U.S. companies in the recent trade activity. This could include increased domestic manufacturing and supply chain diversification.
University of Arizona Pioneering Technical Education Beyond Semiconductors
04/18/2025 | Marcy LaRont, PCB007 MagazineWhile many universities struggle to keep their curriculum up to date with the evolving needs of the electronics industry, the University of Arizona stands head and shoulders above the others. Its Center for Semiconductor Manufacturing incorporates five of the colleges at UA and emphasizes an interdisciplinary approach to prepare students for diverse careers in technology and manufacturing.
IPC Strengthens Electronics Industry Awareness with Appointment of Carrie Sessine as Global Communications Vice President
04/16/2025 | IPCIPC, the global electronics association, announces the strategic appointment of Carrie Sessine as vice president of global communications. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to global innovation and economic growth.