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SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips

01/15/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden Administration’s decision to publish an interim final rule titled, “Export Control Framework for Artificial Intelligence Diffusion.”

SEMI Industry Strategy Symposium 2025 Opens to Highlight Solutions for Managing Rapid Semiconductor Industry Growth

01/14/2025 | SEMI
Industry Strategy Symposium (ISS) 2025 sessions open gathering semiconductor industry executives for analysis of growth projections and pivotal business trends for the year ahead.

Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem

01/13/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon

01/09/2025 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
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