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Advanced Electronics Packaging Digest

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Ignium Acquires Action Manufacturing Company

10/05/2026 | BUSINESS WIRE
Ignium LLC announced the acquisition of Action Manufacturing Company. Action is a leading supplier of fuzing and target-sensing ordnance, supporting U.S. and allied priorities in precision strike, counter-UAS, and long-range fires.

FCT Introduces Liquid Leak Detection Flex Assembly for AI and High-Performance Computing Systems

09/21/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies Inc. (FCT) is pleased to announce the development of its Liquid Leak Detection Flex Assembly, a custom-engineered sensing solution designed for liquid-cooled AI servers, high-performance computing (HPC) systems, cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and other mission-critical electronics.

Mobix Labs Secures $1M+ Follow-On Order for Threat-Detection Sensor Subsystems

09/17/2026 | BUSINESS WIRE
Mobix Labs, Inc. , a U.S.-based supplier of advanced connectivity and sensing solutions for national security, announced that it has received a multi-unit follow-on production order in excess of $1 million for advanced RF sensing subsystems from a leading security-technology provider.

Global Tier-1 YFORE Launches U.S. Manufacturing Factory in Atlanta

08/28/2026 | PRNewswire
YFORE officially inaugurated its new 62,225 sq. ft. American Headquarters in Suwanee, Georgia. Integrating R&D, manufacturing, procurement, sales, and delivery, the facility brings agile engineering and resilient local supply chains directly to local automotive partners.

Renesas Opens Physical AI & Robotics Lab in Beijing

08/27/2026 | BUSINESS WIRE
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the official opening of its Physical AI & Robotics Lab in Beijing, China.
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