-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
November 22, 2024 | Real Time with... electronicaEstimated reading time: Less than a minute
Marcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production. Click here to listen.
For more coverage from electronica 2024 or to visit our event photo gallery, click here.
Suggested Items
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Trump Copper Tariffs Spark Concern
07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.
Flexible Printed Circuit Board Market to Reach US$40.447 Billion by 2030
07/10/2025 | Globe NewswireThe flexible printed circuit board market will grow at a CAGR of 8.28% to be valued at US$40.447 billion in 2030 from US$27.17 billion in 2025.
TTM Technologies Prepares For the Future with the Acquisition of a Facility in Wisconsin and Land in Penang
07/10/2025 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (PCB), announced the acquisition of a 750,000-square-foot facility in Eau Claire, Wisconsin, as well as land rights for an additional future manufacturing site in Penang, Malaysia.
Schweizer Electronic: Annual General Meeting Approves All Proposed Resolutions with a Large Majority
07/10/2025 | Schweizer Electronic AGThe Annual General Meeting of Schweizer Electronic AG took place on June 27, 2025, at the company's headquarters in Schramberg.