American Made Advocacy: How Congress Can Restore the U.S. Printed Circuit Board Industry
Defense Speak Interpreted: Weapons—Electrical Power vs. Energetics
The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics
VORAGO Technologies, Collabora Partner to Advance Open Source in Space
November 25, 2024 | GlobeNewswireEstimated reading time: 1 minute
VORAGO Technologies, a leading provider of radiation hardened and radiation tolerant MCUs and MPUs for Aerospace and Defense, and Collabora, a leader in open source software and support, announced they are partnering to advance the use of open source to achieve resilience for mission critical applications in space.
"As Linux is gaining traction in the Aerospace & Defense market, engineers need to ensure that open source is meeting the specific challenges of ensuring security and reliability in the extreme environment and unique conditions of space. With this partnership, we saw an opportunity to better support our customers by bringing together our expertise in the space market with Collabora's deep expertise in open source," said Ken Obuszewski, VP of Business Development and Product at VORAGO Technologies. "As we continue to expand our portfolio, we want to make sure that all of our customers have access to the resources and support they need to continue innovating with our components. Open source will be key to that effort, and we are excited to bring the Collabora team to the table with us."
"Collabora commends VORAGO Technologies for recognizing the critical importance of paying attention to the software platform when it comes to offering Arm®-based microprocessors, particularly those with embedded graphics processors (GPU). Customers are too often left to handle software issues that should have been identified and handled much sooner," said Guy Lunardi, VP of Business Development at Collabora. "We are delighted to be partnering with VORAGO Technologies to deliver the most comprehensive Open Source software developer experience, with a strong emphasis on customers' development teams and their use cases, far surpassing any BSP previously available in the Aerospace & Defense market."
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
OpenAI and Foxconn Collaborate toStrengthen U.S. Manufacturing Across the AI Supply Chain
11/21/2025 | OpenAIOpenAI announces a collaboration with Foxconn focused on design work and U.S. manufacturing readiness for the next generation of AI infrastructure hardware. As part of this work, OpenAI will share insight into emerging hardware needs across the AI industry to help inform Foxconn’s design and development efforts for hardware to be manufactured at Foxconn’s U.S. facilities.
AV, OpenJAUS Announce Collaboration for Autonomous Uncrewed System (UxS) Interoperability
10/31/2025 | BUSINESS WIREAeroVironment, Inc. (AV), a global defense technology leader delivering software-enabled disruptive autonomous systems, announced a collaboration with OpenJAUS, LLC., a leader in middleware software solutions for unmanned and robotic systems, to integrate the JAUS standard into AV_Halo™ Command, a first-of-its-kind cross-architecture software solution for controlling uncrewed systems (UxS).
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
AMD, OpenAI Announce Strategic Partnership to Deploy 6 Gigawatts of AMD GPUs
10/06/2025 | OpenAIAMD and OpenAI today announced a 6 gigawatt agreement to power OpenAI’s next-generation AI infrastructure across multiple generations of AMD Instinct GPUs. The first 1 gigawatt deployment of AMD Instinct MI450 GPUs is set to begin in the second half of 2026.
AMD Acquires Brium to Strengthen Open AI Software Ecosystem
06/05/2025 | AMDAt AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.