-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
CIL Installs Third Volume Auto SMT Line with In-Line 3D AOI at BP2 Facility
November 25, 2024 | CILEstimated reading time: 3 minutes
In early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility. This now gives CIL three identical volume PCBA lines that can be configured for three single sided PCBA lines all with auto load, SMT placement, reflow, in-line 3D automatic optical inspection (AOI) and auto unload. Alternatively, they can be configured as one double sided SMT PCBA assembly line with “hands off” production capability complete with in-line 3D AOI both sides and this new additional single sided SMT line. These volume SMT PCBA lines have the capacity to produce 15,000 PCBA’s per week. This capability and capacity increase is for SMT PCBA assemblies going into CIL’s new Semiconductor packaging facility for “chip on board” type assemblies and also to place semiconductor packages such as custom QFN’s that have been manufactured in its cleanroom in the same facility. Additionally, these lines will also support any of CIL’s existing and new customers whose product is currently manufactured at its CIL House facility to go from small / medium to volume production as the SMT printers, SMT placement machines and reflow ovens are all 100% compatible complete with component test fitted to all 8 placement lines. All of them are currently placing 0201 passives and BGA / WLCSP / CSP / Flip chip daily.
This now puts CIL in a unique UK position for its customers in offering the total PCBA solution. Prototype, small, medium and volume PCBA production as well as the UK’s largest Semiconductor packaging facility for power and Microelectronics development and production. Weekly batch sizes now range from 1-5 off for prototypes, 5 – 1000 off for small – medium volumes and 1000 – 10,000 per week for volume.
These SMT PCBA assembly lines now comprise of the following
- 3 off DEK NeoHorizon 03iX Solder printers
- 3 off MYCRONIC MY300DX SMT Placement machines with built in component test.
- 3 off Vitronics 10 zone Reflow Ovens
- 3 off Koh Young ALPHA HS 3D AOI Inspection
- Multiple Auto-load /Auto-unload / Flip conveyors for “hands off” production
- 1 off NC25 PCB Cleaner
- 1 off DAGE QUADRA7 Pro X-Ray / CT Scan system.
- 1 off Cencorp SR1300 PCB Automatic Router
- 4 off N2 Storage cabinets.
The existing facility at CIL House Andover remains as is, to provide a PCBA assembly service for prototyping, and small to medium volume production of complex PCBA assembly and test. In addition to its 4 off SMT lines at CIL House, CIL recently installed a stand-alone RAPID prototype SMT PCBA line to allow CIL to give its customers the full-service package, prototype, small, medium and volume production quantities. So, CIL is now able to offer a dedicated prototype capability, followed by small to medium volumes on its 4 off SMT lines at CIL House. If required, volume production is then transferred seamlessly to the BP2 facility, all located at Andover, UK. As well as Surface mount (SMT), CIL does of course offer 3D AOI, Flying Probe Test (FPT), Thru hole soldering to IPC Class 2 and Class 3, X-ray, CT scan, and full PCBA assembly test and diagnostics.
This upgrade has resulted in CIL now having a total of 8 off SMT lines running, with a further 1 off planned in Q2 2025 with further space capacity for a further 4 off lines as and when required. This will include all other support equipment such as PCB cleaners, PCB routers, X-Ray and functional test equipment. In all of its assembly equipment at both facilities, CIL has strived to keep with its existing supplier partners for two reasons. Firstly, the after sales service they provide is known and secondly it gives CIL an improved disaster recovery plan. The equipment and facilities used at both Andover locations are almost identical and therefore CIL can switch production between the two facilities with ease. With the same solder printers, SMT placement machines, reflow ovens, conveyors, cleaners and PCB routers all of the processes are known, controlled and now duplicated.
CIL's total SMT PCBA assembly lines now comprise of the following
- 8 off DEK NeoHorizon 03iX Solder printers
- 1 off MYCRONIC MY700 Ink jet solder system
- 1 off MYCRONIC MY500 Ink jet solder system
- 8 off MYCRONIC MY300DX SMT Placement machines with built in component test.
- 8 off Vitronics 10 zone Reflow Ovens
- 3 off Koh Young ALPHA HS 3D AOI Inspection systems
- 2 off Koh Young ZENITH 2 3D AOI Inspection systems
- 2 off TAKAYA APT1400F Flying probe test systems
- Multiple Auto-load /Auto-unload / Flip conveyors for “hands off” production
- 3 off NC25 PCB Cleaners
- 1 off DAGE QUADRA7 Pro X-Ray / CT Scan system
- 1 off DAGE QUADRA5 X-Ray / CT Scan system
- 3 off Cencorp SR1300 PCB Automatic Router
- 12 off N2 Storage cabinets.
Suggested Items
Modernizing TAURUS for the Bundeswehr
12/25/2024 | MBDAThe Bundeswehr and TAURUS Systems GmbH (a joint venture between MBDA and SAAB) have signed a contract for the maintenance and modernization of the TAURUS stand-off weapon system. The measures will ensure the weapon's operational readiness until at least 2045.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
Cicor Publishes Nine-month Results Report due to OEP Mandatory Offer
12/20/2024 | CicorCicor Group is publishing a nine-month report today. OEP has published a mandatory offer after it converted its Mandatory Convertible Bonds (MCNs) and thereby crossed the mandatory offer threshold.
Cadence Appoints Moshe Gavrielov to Board of Directors
12/13/2024 | Cadence Design SystemsCadence Design Systems, Inc. announced the appointment of Moshe Gavrielov to its board of directors, effective January 1, 2025. Mr. Gavrielov currently serves as a member of the board of NXP Semiconductors N.V. and Taiwan Semiconductor Manufacturing Company Ltd., as chair of the board of Foretellix and SiMa.ai, and has previously held executive roles at several global technology companies.
OEP 80 B.V. Published Cicor’s Pre-Announcement for Mandatory Offer
12/09/2024 | CicorCicor Group announces that OEP 80 B.V. (OEP) published the pre-announcement for a mandatory offer for all the shares of Cicor Technologies Ltd. held in the public.