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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec

01/08/2026 | I-Connect007
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.

Beyond Design: Managing Linear Workflow Bottlenecks

01/08/2026 | Barry Olney -- Column: Beyond Design
The PCB design flow is sequential by nature, transitioning through distinct yet interdependent phases, from initial back-of-the-envelope concept sketches to schematic capture, constraint definition, physical layout, verification, and finally, generation of CAM deliverables. Each stage builds upon the last, and any delay, however minor, can cascade downstream, amplifying pressure on subsequent phases.

Your 2026 Business Playbook: Step 8: Improve Communication and You Improve Everything

12/19/2025 | Dan Beaulieu, D.B. Management Group
Your communication is either your greatest advantage or your greatest challenge. There is no middle ground. After 35+ years working with PCB shops, I can tell you with absolute certainty that the shops that communicate well win, while those that communicate poorly struggle. It’s not because they lack capability, technology, or talent. They struggle because people are not talking to each other at the right time, about the right things, with the right clarity.

December 2025 PCB007 Magazine: Automate to Elevate

12/15/2025 | I-Connect007 Editorial Team
In the December issue of PCB007 Magazine, we discuss how the present and future of AI, machine learning, and automation in PCB fabrication can make a significant impact on your business. Our contributors on this theme include Sydney Xiao, president of Global Electronics Association East Asia; columnists Happy Holden, Don Ball, and Shane Whiteside; and Henger Electronics’ Zhiqiang Li and Ping Tang.

The Next Five Years of Thermal Substrates, Ceramics, and Thick-film PCBs

12/11/2025 | Brian Buyea, Remtec
If you want a clean view of where thermal substrates and ceramic/thick-film electronics are headed, follow the heat. Power density is moving up and to the right across industries: EV traction inverters, fast chargers, AI data centers, radar, satellite payloads, medical imaging, and high-brightness LEDs. The next five years will be defined by designs that treat thermal performance as a first-order constraint, not an afterthought. Here’s what that means in practice.
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