Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Don't Buy AI, Learn It: A Fabricator's Guide to Getting Started, Part 2

06/23/2026 | Sean Patterson, CrossGen AI
In Part 1, I covered common challenges encountered on a PCB shop floor, the missteps companies make when attempting to implement AI, and best practices to start that journey with a significantly higher likelihood of success. I identified six areas where AI’s strength in aggregating data can make the shop floor run more smoothly, create better process documentation across departments and between shifts, and even help capture tribal knowledge.

It’s Only Common Sense: Just Imagine…

06/22/2026 | Dan Beaulieu -- Column: It's Only Common Sense
There’s an old story that says we're all artists in first grade. Just ask a room full of 6-year-olds. One kid draws dinosaurs wearing sneakers. Another builds a spaceship out of cereal boxes and glue sticks. Somebody paints the sky green because they feel like it. Nobody apologizes for their ideas or worries about being judged. They just create without fear. But, as the story goes, we get older. We become more experienced and practical. We learn rules, structure, and how business is “supposed” to work. We slowly trade crayons for spreadsheets and imagination for caution. Little by little, we retire the most creative part of ourselves long before we retire from work.

Thermoreflectance and Solving the Thermal Puzzle in 3D Packaging

06/11/2026 | Marcy LaRont, I-Connect007
Advanced packaging and 3D heterogeneous integration are rapidly redefining the next phase of the semiconductor industry, delivering unprecedented performance gains while posing significant thermal management challenges. In this interview, Dr. Mohammad (Mo) Shakouri, founder and CEO of Microsanj, discusses how thermoreflectance-based metrology is enabling engineers to visualize and measure heat behavior at the nanoscale within complex packages, interposers, and TSV structures.

Rethinking Resilience: How Electronic Component Recovery Is Reshaping the Supply Chain

06/11/2026 | Rob Ronan, Retronix Ltd.
The first article in this series explored how semiconductor shortages exposed the fragility of global supply chains. But shortages are only one part of a broader challenge. The electronics supply chain has always been complex, but in recent years it has become something else entirely: unpredictable. From pandemic-driven disruptions to geopolitical tensions and sudden demand spikes, manufacturers have been forced to confront the hard truth that traditional sourcing strategies are no longer enough.

50 Years of Successful SPEA Testing Solutions

06/10/2026 | Nolan Johnson, SMT007 Magazine
SPEA is celebrating 50 years of test innovation, building on the vision of founder Luciano Bonaria, whose zero-failure philosophy continues to shape the company today. In this interview, Andrea Furnari, vice president of sales and marketing (based in Volpiano, Italy), and Dustin Warren, vice president and regional director (based in Dallas, Texas), reflect on that legacy while pointing to what’s next, from expanding global support to new developments in AI-driven test and high-performance platforms.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in